Flexible display device

Abstract

The invention relates to the technical field of display, and discloses a flexible display device. The flexible display device comprises a substrate, an insulating layer arranged on the substrate, an organic light emitting device body arranged on the insulating layer, and an encapsulation layer arranged on the organic light emitting device body and used for sealing the organic light emitting device body, wherein cutting grooves are formed in a packaged region in the connecting position between the insulating layer and the encapsulation layer. According to the flexible display device, by forming the cutting grooves in the packaged region in the connecting position between the insulating layer and the encapsulation layer, an effect of prolonging a path of water which enters the packaged region and then is in contact with the organic light emitting device body is achieved, thereby improving the encapsulation effect of the encapsulation layer, effectively lowering probability of water in entering the encapsulation layer, improving the body encapsulation success rate, also prolonging the service life of the organic light emitting device body, and further prolonging the service life of the flexible display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible display device. Background technique [0002] Organic electroluminescent devices have the characteristics of self-luminescence, high brightness, high contrast, low operating voltage, and flexible display, and are known as the most promising display devices. However, the devices in organic electroluminescent devices have poor tolerance to the surrounding environment. In the prior art, thin-film packaging methods are used to isolate organic electroluminescent devices from the external environment, specifically, through the combination of multilayer organic-inorganic thin films Form the encapsulation layer of the package. [0003] When the organic electroluminescent device is packaged, the packaging layer is connected to the organic electroluminescent device. Since the bonding area between the packaging layer and the interface is unstable, when the edge of the organic e...

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Problems solved by technology

However, the devices in organic electroluminescent devices have poor tolerance to the surrounding environment. In the prior art, thin film packaging methods are used to isolate organic electroluminescent devices from the external environment, specifically, through the combination of multilayer organic-inorganic thin films encapsulation layer

[0003] When the organic electroluminescent device is packaged, the packaging layer is connected to the organic electroluminescent device. Since the bonding area between the packaging layer and the interface is unstable, when the edge of the organic electroluminescent device is cut, the packaging layer, interface The connection with the encapsulation layer and the cut of the interface are prone to cracks, allowing moisture to enter the encapsulation layer, causing damage to the organic electroluminescent device body and resulting in failure of the overall encapsulation

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