A kind of manufacturing process of die-cutting knife plate
A production process and die-cutting knife technology, which is applied in the field of die-cutting knife plate production process, can solve the problems such as chips sticking to the die-cutting board, affecting cardboard forming, and affecting forming quality, so as to eliminate adhesion and reduce waste products High efficiency, scientific and reasonable effect of the production process
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Embodiment 1
[0023] A manufacturing process of a die-cutting knife plate, comprising the following steps:
[0024] S1. First design and draw the drawing of the die-cutting knife plate, and cut out the die-cutting knife plate with laser according to the drawing;
[0025] S2. Stencil processing: the die-cutter is made of YW1 or YW2 stainless steel material; the die-cutter is reshaped, and the leading angle of the knife is 60°, the rake angle is 25°, and the back angle is 10°.
[0026] S3. Die-cutting board processing: Polish and polish the surface of the die-cutting board, and then process a core plate groove and a core plate matching the size of the core plate groove on the die-cutting board, and set the core plate and the core plate groove correspondingly Locating pin holes, die-cutting knife grooves are set on the core plate.
[0027] S4. Installation of the knife plate: fix the knife plate vertically in the die-cutting knife slot, then place the core plate in the core plate slot, and fi...
Embodiment 2
[0031] This embodiment is further defined on the basis of the above embodiments. In the step S2, the inclination angle of the blade on the blade is λ=-3°, and the blade is ground with a chamfer of 0.1-0.15 mm. The blade inclination angle adopts λ=-3°, which is convenient for chip removal, and the chips will not damage the machined surface; when λ=-3°, the chamfer surface will produce line-mounted blue auxiliary chips (ie, tool tumor chips), which are located in the middle of the main chips. Adhesion of the knives to the machined surface is eliminated.
[0032] Other parts of this embodiment are the same as those of the foregoing embodiment, and will not be repeated here.
Embodiment 3
[0034] This embodiment is further defined on the basis of the above embodiments. In step S3, the surface roughness of the die-cut board is Ra=0.12. The surface finish seriously affects the degree of chip removal. After the surface is polished to a smoothness of Ra=0.12, the chips can be discharged smoothly to avoid affecting the subsequent cutting process and cutting accuracy.
[0035] Other parts of this embodiment are the same as those of the foregoing embodiment, and will not be repeated here.
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