A preparation process of copper strip for frame material

A technology for preparation process and frame material, which is applied in the field of preparation process of copper strip for frame material, can solve the problems that the high temperature softening hardness index cannot meet the use requirements, the comprehensive performance cannot meet the use requirements, and it is difficult to meet the use requirements. Good thermal processing performance, good follow-up processing performance, and the effect of reducing electrical conductivity

Active Publication Date: 2019-08-13
中铝洛阳铜加工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, with the rapid development of the electronics industry, China's demand for high-power plastic-encapsulated transistors and frame materials for integrated circuits is increasing. Among them, copper tape for special-shaped frame materials is an easy-to-process and high-yield product, which is reflected in the market. It has the advantages of corrosion resistance, formability, extensibility, electrical conductivity, weldability and beautiful color of non-ferrous metals. With the application requirements and application direction becoming wider and wider, the market is more and more suitable for high-end special-shaped frame materials that are easy to process. The requirements for copper strips are gradually increasing, and the conductivity and high-temperature softening hardness of copper strips for high-end special-shaped frame materials are beyond the range of ordinary copper alloy national standards. Subsequent processing such as rolling will seriously change the structure of the material, resulting in the situation that the overall performance of the material cannot meet the requirements after processing, especially the high-temperature softening hardness index cannot meet the requirements of use, and high-end special-shaped frame materials are used After the annealing treatment of the subsequent processing, the electrical conductivity of the copper strip will drop significantly, and it is difficult to meet the requirements of use, and the existing production process is difficult to produce a frame material that meets the requirements of use; in view of the above reasons, a frame material is now invented Preparation process of copper strip

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  • A preparation process of copper strip for frame material

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Embodiment 1

[0044] It is used for special-shaped frame material products that require high temperature softening hardness in the subsequent processing process and ensure electrical conductivity. Its comprehensive performance is that the copper strip requires a soft state before forging, and the copper strip is required to be harder, with high conductivity and high conductivity after forging. High temperature softening hardness is high, and its technical requirements are:

[0045] Brand: LY80

[0046] Copper strip specification: 1.52×42mm

[0047] State: soft state (M)

[0048] Mechanical property requirements: tensile strength Rm195-300MPa, elongation A11.3≥35%, hardness HV70-80, hardness after forging HV105-125, high temperature softening hardness HV≥100

[0049] Tolerance requirements: thickness tolerance ±0.02mm, width tolerance ±0.20mm

[0050] Conductivity: ≥88%IACS, conductivity after forging ≥85%IACS

[0051] The processing technology is as follows:

[0052] The first step, batc...

Embodiment 2

[0077] It is used for special-shaped products that require high temperature softening hardness and high conductivity in the subsequent processing process. The comprehensive performance is that the copper strip requires a soft state before forging, and the copper strip is required to be hard, high conductivity and high temperature after forging. The softening hardness is high, and its technical requirements are:

[0078] Brand: LY80

[0079] Copper strip specification: 2.0×48mm

[0080] State: soft state (M)

[0081] Mechanical property requirements: tensile strength Rm195-300MPa, elongation A11.3≥35%, hardness HV70-80, hardness after forging HV105-125, high temperature softening hardness HV≥100

[0082] Tolerance requirements: thickness tolerance ±0.02mm, width tolerance ±0.20mm

[0083] Conductivity: ≥88%IACS, conductivity after forging ≥85%IACS

[0084] The processing technology is as follows:

[0085] The first step, batching: use the standard cathode electric copper a...

Embodiment 3

[0110] It is used for special-shaped products that require high temperature softening hardness and high conductivity in the subsequent processing process. The comprehensive performance is that the copper strip requires a soft state before forging, and the copper strip is required to be hard, high conductivity and high temperature after forging. The softening hardness is high, and its technical requirements are:

[0111] Brand: LY80

[0112] Copper strip specification: 2.4×59mm

[0113] State: soft state (M)

[0114] Mechanical property requirements: tensile strength Rm195-300MPa, elongation A11.3≥35%, hardness HV70-80, hardness after forging HV110-130, high temperature softening hardness HV≥100

[0115] Tolerance requirements: thickness tolerance ±0.02mm, width tolerance ±0.20mm

[0116] Conductivity: ≥88%IACS, conductivity after forging ≥85%IACS

[0117] The processing technology is as follows:

[0118] The first step, batching: use the standard cathode electric copper a...

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Abstract

Provided is a preparation process of a copper strip for a framework material. The preparation process comprises the technological steps of proportioning, smelting, casting, saw cutting, hot rolling, face milling, finished product milling, edge shearing, finished product annealing, washing, finished product shearing and packaging and putting into a storage. Compared with a special-shaped framework material manufactured by an original process, the copper strip produced by the preparation process has the remarkable advantages of high strength, good electrical conductivity, good subsequent machining performance and the like, chemical components of the material are stable, the surface is clean, smooth, free of oxidation discoloration, and free of defects like peeling, burrs, bubbles, cracks, layering, inclusion, holes, black points, folding, verdigris, scratching and corrosion, the copper strip can adapt to the more severe use environment, and the service life of a profiled bar is prolonged.

Description

technical field [0001] The invention relates to the field of nonferrous metal smelting and processing, in particular to a preparation process of a copper strip for frame materials. Background technique [0002] At present, with the rapid development of the electronics industry, China's demand for high-power plastic-encapsulated transistors and frame materials for integrated circuits is increasing. Among them, copper tape for special-shaped frame materials is an easy-to-process and high-yield product, which is reflected in the market. It has the advantages of corrosion resistance, formability, extensibility, electrical conductivity, weldability and beautiful color of non-ferrous metals. With the application requirements and application direction becoming wider and wider, the market is more and more suitable for high-end special-shaped frame materials that are easy to process. The requirements for copper strips are gradually increasing, and the conductivity and high-temperatur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22C1/02C22F1/08C22F1/02B22D11/111
CPCB22D11/004B22D11/111C22C1/02C22C9/00C22F1/002C22F1/02C22F1/08
Inventor 郭慧稳万建丁顺德刘月梅姚廷鑫崔江涛刘荣彬
Owner 中铝洛阳铜加工有限公司
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