Computer host with good heat dissipation performance

Abstract

The invention discloses a computer host with the good heat dissipation performance. The computer host comprises a computer case, a vertical hinged door, side panels, a small heat dissipation fan, a heat conducting piece, a small dust collector, a host body, an anti-damping pad, a dehumidifier, a power-off protector and a base. The side panels are arranged on the two sides of the computer case respectively. An installation frame is fixedly arranged on the side panels, and a small heat dissipation fan is installed on the installation frame, a partition plate with hole is fixedly arranged inside the computer case, a damping spring is fixedly arranged between the computer case and the partition plate with the hole. The host body is fixedly arranged inside the partition plate with the hole. A dustproof heat dissipation cover is fixedly arranged at the front end of the host body, the top of the host body is fixedly provided with a partition layer, the small dust collector is fixedly arranged inside the partition layer, the working end of the small dust collector is located inside the host body, and the power-off protector is fixedly arranged on one side of the top of the host body. The computer host with the good the heat dissipation performance is reasonable and simple in design, convenient to operate, good in stability, high in reliability and good in safety, suitable for being widely polarized.

Description

technical field [0001] The invention relates to a computer host, in particular to a computer host with good heat dissipation performance. Background technique [0002] Heat is an unavoidable by-product of all electronic products, and efforts must be made to minimize the effects of heat on the product. When the computer runs the software that occupies too much memory, the temperature of the computer motherboard and CPU will rise in a short time. If the heat cannot be dissipated quickly, the performance of the computer will deteriorate, and even automatic shutdown will occur. . Contents of the invention [0003] The main purpose of the present invention is to provide a computer mainframe with good heat dissipation performance, which can effectively solve the problems in the background technology. [0004] In order to achieve the above object, the technical scheme that the present invention takes is: [0005] A computer mainframe with good heat dissipation performance, com...

AI Technical Summary

Problems solved by technology

When the computer runs the software that occupies too much memory, the temperature of the computer motherboard and CPU will rise in a short time. If the heat cannot be dissipated quickly, the performance of the computer will deteriorate, and even automatic shutdown will occur.

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