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A three-dimensional photonic device interconnection method based on fused direct writing

A photonic device, three-dimensional technology, applied in the field of three-dimensional photonic device interconnection based on fusion direct writing, can solve problems such as long response time, achieve low cost, improve graphics conversion accuracy, and inhibit the increase of surface roughness.

Active Publication Date: 2019-10-18
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Semiconductor is the material with the largest nonlinear optical value, but the response time is limited by the carrier recombination time and is longer

Method used

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  • A three-dimensional photonic device interconnection method based on fused direct writing
  • A three-dimensional photonic device interconnection method based on fused direct writing
  • A three-dimensional photonic device interconnection method based on fused direct writing

Examples

Experimental program
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Effect test

Embodiment 1

[0030] In this embodiment, the purpose is to prepare a photon transmission fiber (optical waveguide) to connect optical signals at different parts of the same chip layer. Specifically: glass sulfide (As 2 S 3 ) is placed in a molten pool with a micro-alloy nozzle with a diameter of 100 μm, and the molten pool is heated to 1200 °C by means of inductive heating, so that the vulcanized glass is melted into a liquid state. At this time, the melt viscosity is 700 Pa·s; then, in the melt After extruding to the first bonding point, apply a static pressure of 10kPa to continuously extrude the melt, and at the same time move the nozzle to perform direct writing from the bottom up to form a straight line interconnecting optical fiber with a diameter of 100 μm to the second bonding point.

Embodiment 2

[0032] In this embodiment, the purpose is to prepare a photonic transmission fiber (optical waveguide) to connect optical signals of different chip layers. Specifically: the multi-component glass (SiO 2 -CaO-Na 2 O) placed in a micro-ceramic nozzle molten pool with a diameter of 100 μm, and heated the molten pool to 1000 ° C by arc heating to make SiO 2 -CaO-Na 2 O is melted into a liquid state. At this time, the melt viscosity is 1000Pa·s; then, after the melt is extruded to the first bonding point, a static pressure of 800kPa is applied to continuously extrude the melt, and at the same time, the nozzle is moved from bottom to top Direct writing was performed to form a curved interconnect fiber with a diameter of 99 μm to the second bonding point.

[0033] Figure 4 The curved glass interconnection optical fiber obtained in this embodiment is shown, and the interconnection line is located between two different layers of chips, so as to realize the transmission of photonic...

Embodiment 3

[0035] In this embodiment, the purpose is to prepare a photonic transmission fiber (optical waveguide) to connect optical signals of different chip layers. Specifically: quartz glass (SiO 2 -GeO 2 ) is placed in a molten pool with a micro-alloy nozzle with a diameter of 10 μm, and the molten pool is heated to 1200 °C by means of dielectric heating, so that SiO 2 -GeO 2 Melt into a liquid state, at this time, the melt viscosity is 800Pa·s; then, after the melt is extruded to the first bonding point, a static pressure of 9kPa is applied to the melt to continuously extrude, while moving the nozzle from bottom to top Direct writing, forming a helical curve with a diameter of 9 μm to interconnect the fiber to the second bonding point.

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Abstract

The invention discloses a three-dimensional photonic device interconnection method based on melting direct-writing. The three-dimensional photonic device interconnection method comprises steps that step1, a photoconductive material having high transparency is molten in a heating molten pool having a mini-sized nozzle to be in a liquid state; step2, a high precision displacement bench is used to move the mini-sized nozzle to a first bonding point, and under action of static pressure, the molten photoconductive material is extruded continuously from the mini-sized nozzle, and is bonded with the first bonding point; step3, the mini-sized nozzle is moved to carry out the direct-writing from bottom to top, and a photon transmission optical fiber is formed, and then the mini-sized nozzle is moved to a second bonding point, and then the photon transmission optical fiber is bonded with the second bonding point, and hierarchical interconnection of a multi-layer integrated optical path is realized. By adopting a molten liquid bonding technology, repeatability is good, and production precision can reach a nano-meter level, and coupling compatibility with the optical fiber is realized, and therefore surface scattering loss of a produced three-dimensional glass optical waveguide is small, and the method is suitable for the high-integration three-dimensional photonic device and a high-sensitivity sensor.

Description

technical field [0001] The invention relates to the field of integrated optical circuits and integrated optical waveguide devices, in particular to a three-dimensional photonic device interconnection method based on fusion direct writing. Background technique [0002] The integrated optical circuit is an integrated optical system formed by integrating and miniaturizing a series of discrete optical devices, such as prisms, lenses, gratings, and optical couplers. In the integrated optical path, each optical element is formed on a wafer substrate and connected with an optical waveguide formed inside or on the surface of the substrate, which is an important way to solve the miniaturization of the original optical system and improve the overall performance. The information capacity processed by the integrated optical circuit is much larger than that of the integrated circuit. At the same time, the integrated optical circuit also has multi-dimensional information processing capabi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/255
Inventor 郭建军唐玉蓉徐鼎鼎雷雨许高杰
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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