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How to disassemble the chip

A chip and cavity technology, applied in the field of chip disassembly, can solve the problems of prone to collapse, chip damage, disassembly failure, etc., and achieve the effect of avoiding collapse

Active Publication Date: 2019-12-13
SHANGHAI IND U TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous improvement of chip integration, the line width continues to shrink, and the size of the sensing elements is very small. During the cutting process of the MEMS chip, due to the support of the sensing elements in the cavity Less, prone to collapse and other problems, resulting in damage to the inside of the chip, resulting in failure to disassemble, and unable to obtain a complete and correct structural diagram of the inside of the chip
[0005] Therefore, the dismantling effect of the existing chip dismantling method needs to be further improved.

Method used

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  • How to disassemble the chip
  • How to disassemble the chip
  • How to disassemble the chip

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Embodiment Construction

[0029] The specific implementation of the chip disassembly method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] Please refer to figure 1 , is a schematic flowchart of a chip disassembly method according to a specific embodiment of the present invention.

[0031] Step S1: providing a chip, including a substrate, a plurality of components on the substrate, and a packaging case, a cavity is formed between the packaging case and the substrate, and the plurality of components are located in the cavity.

[0032] Step S2: Grinding the side wall of the cavity until a corner of the cavity is exposed.

[0033] Step S3: filling the cavity with a support material to form a support layer.

[0034] Hereinafter, the above-mentioned steps will be described in detail.

[0035] Please refer to figure 2 and image 3 , execute step S1, provide a chip, wherein figure 2 is a schematic cross-sectional view of the c...

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Abstract

The invention provides a disassembling method for chips. The method comprises the steps of: providing a chip which comprises a substrate, elements located on the substrate and a packaging shell, wherein the packaging shell and the substrate form a cavity in which the elements are located; grinding the side wall of the cavity until one corner of the cavity is exposed; filling the cavity with supporting material to form a supporting layer. The disassembling method can prevent collapse of elements in a chip in a disassembling process.

Description

technical field [0001] The invention relates to the technical field of micro-electro-mechanical systems, in particular to a chip disassembly method. Background technique [0002] In the manufacturing process of MEMS chips, the reverse disassembly process is the most effective way to understand the internal structure of MEMS chips, and then it is an important method for the research and improvement of MEMS chips. [0003] In the traditional method, the MEMS chip is usually cut directly, and by observing the cut side, information such as the component structure inside the chip can be obtained. [0004] However, in many MEMS chips, such as gyroscope sensor chips, pressure sensor chips, accelerometer sensor chips, etc., the sensing elements are located in the cavity, and some elements are suspended. With the continuous improvement of chip integration, the line width continues to shrink, and the size of the sensing elements is very small. During the cutting process of the MEMS c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
CPCH01L21/02
Inventor 吴波张文燕
Owner SHANGHAI IND U TECH RES INST