Package carrier board with heat sink and preparation method thereof
A technology for encapsulating carrier boards and heat sinks, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems that affect the life of circuit boards, and the heat of electronic components cannot be effectively conducted and dissipated. To achieve the effect of improving heat dissipation efficiency
Active Publication Date: 2019-11-12
礼鼎半导体科技秦皇岛有限公司 +2
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- Application Information
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Problems solved by technology
[0003] However, since the electronic components are directly buried in the circuit board, the heat generated by the electronic components cannot be effectively conducted and dissipated, thus affecting the life of the circuit board
Method used
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Embodiment Construction
[0052] Please refer to Figure 1 to Figure 14 , The manufacturing method of the package carrier 100 of the first embodiment of the present invention includes the following steps:
[0053] Step S11, please refer to figure 1 , Provide a substrate 10. The substrate 10 includes a supporting board 11 and a copper foil layer 12 formed on one surface of the supporting board 11. The carrying plate 11 can be made of metal or resin.
[0054] Step S12, please refer to figure 2 , A first insulating layer 20 is covered on the surface of the copper foil layer 12 away from the carrier board 11, a plurality of first through holes 21 are opened in the first insulating layer 20, and then at least two adjacent A heat conducting portion 220 is formed in the first through hole 21, and a first conductive portion 22 electrically connected to the copper foil layer 12 is formed in the other first through holes 21. The top of each first conductive portion 22 extends out of the first through hole 21 to fo...
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An encapsulation carrier board includes a copper foil layer on which first to third insulating layers are sequentially arranged. The first insulation layer is provided with a heat conduction part and a first conduction part, the top ends of which protrude from the first insulation layer to form a mounting surface and a first conductive circuit layer. The second conductive part is arranged on the first conductive circuit layer, and the top ends of the second conductive part jointly form the second conductive circuit layer. The second insulation layer is covered on the second conductive circuit layer, and is provided with an installation groove for exposing the installation surface. A thermal conduction layer is formed in the installation groove. Electronic components are mounted on the surface of the thermal conduction layer corresponding to the mounting surface. A third conductive part is also provided in the second insulating layer, and top ends of the third conductive part jointly form a third conductive circuit layer. The third insulation layer covers the third conductive circuit layer and fills in the installation groove. A fourth conductive portion is formed in the third insulating layer, and top ends thereof together form a fourth conductive circuit layer. The copper foil layer is provided with a fifth conductive circuit layer and a heat sink.
Description
Technical field [0001] The invention relates to a package carrier board, in particular to a package carrier board with a heat sink and a preparation method of the package carrier board. Background technique [0002] In the past, the electronic components (such as IC chips, etc.) contained in the circuit board were usually directly formed on the surface of the circuit board. Under the trend of light, thin, short, small, high-frequency, and multi-functional electronic products, such electronic components are usually embedded in the circuit board during the manufacturing process of the current circuit board. The technology of embedding electronic components in circuit boards has advantages in the miniaturization and thinning of electronic products and the improvement of signal transmission performance, and will surely be more and more widely used in electronic products. [0003] However, since the electronic components are directly embedded in the circuit board, the heat generated by...
Claims
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IPC IPC(8): H01L21/50H01L23/00H01L23/13H01L23/367H01L23/522
CPCH01L21/50H01L23/13H01L23/3672H01L23/5226H01L24/26H01L24/27H01L2224/26H01L2224/27H01L21/568H01L2224/04105H01L2224/12105H01L2224/19H01L2224/73267H01L2224/92244H01L2924/15153
Inventor 叶子建唐池花
Owner 礼鼎半导体科技秦皇岛有限公司