Bonding device and bonding method
A lamination device and lamination technology are applied to household appliances, other household appliances, household components, etc., which can solve problems such as high lamination pressure and warpage, and achieve the effect of reducing material or product warpage
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[0028] The following description is a preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also considered Be the protection scope of the present invention.
[0029] Please refer to image 3 , 4 , the embodiment of the present invention provides a bonding device 10 for bonding the film to the device to be bonded, including a bonding roller 1 and a rubber plate 5 for filling low fluidity glue, the bonding The drum 1 includes a drum 2 and an adsorption plate 3 wound on the outer peripheral surface of the drum, the adsorption plate includes a first surface 31 and a second surface 32 oppositely arranged, and the first surface 31 is provided with a negative pressure The hole 4 is used for absorbing the film, and the adhesive plate 5 is stacked on the second surface 32...
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