Flexible display device

Abstract

A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer. Since the metal layer is non-organic material, it allows excellent adhesion between the metal layer and the inorganic barrier layer. When the flexible display device is bent due to the force, the metal layer is less likely to be broken by bending.

Description

technical field [0001] The invention relates to a flexible display device. Background technique [0002] When fabricating a flexible display device with an organic thin film transistor (Organic Thin Film Transistor; OTFT), a barrier layer, a buffer layer and a circuit layer may be sequentially formed on the flexible substrate. Since the buffer layer is generally made of organic material, and the circuit layer is generally made of metal material, when the circuit layer is formed above the buffer layer, there will be a problem of poor adhesion between the circuit layer and the buffer layer. [0003] When the flexible display device is bent due to force, the circuit layer above the buffer layer is displaced due to poor adhesion. As a result, the circuit layer on the buffer layer is easily broken due to bending. In addition, in the wet etching process, the circuit layer on the buffer layer of the non-display area is also prone to the problem of excessive critical dimension cha...

AI Technical Summary

Problems solved by technology

Since the buffer layer is generally made of organic materials, and the circuit layer is generally made of metal materials, when the circuit layer is formed above the buffer layer, there will be a problem of poor adhesion between the circuit layer and the buffer layer

[0003] When the flexible display device is bent due to force, the circuit layer is displaced due to the poor adhesion of the circuit layer above the buffer layer

As a result, the circuit layer on the buffer layer is prone to fracture due to flexing

In addition, in the wet etching process, the circuit layer on the buffer layer of the non-display area is also prone to the problem of excessive critical dimension change (CD loss)

Therefore, it is difficult to reduce the line width and line spacing of the non-display area, making it difficult to reduce the width of the non-display area

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