Method, system, device and readable storage medium for determining module open position

Abstract

The application discloses a method for determining an open circuit position. The method comprises steps of confirming an open circuit in the module; obtaining a preliminary area of an open circuit point on an open circuit line by comparing an impedance test diagram, a standard impedance test diagram and a PCB diagram of the open circuit line; and obtaining a specific position of the open circuit point by testing an impedance of a target area, wherein the target area is a portion of the module after the cover film is scraped off at a position corresponding to the preliminary area. The inventionrealizes the confirmation of the specific position of the open circuit point in the open circuit line and further analyzes the failure reason of the module specifically, for example, the method of slicing the open circuit point and the like. The present application also discloses a system and a device for determining the open circuit position of the module and a readable storage medium, and has corresponding beneficial effects.

Description

technical field [0001] The invention relates to an integrated circuit, in particular to a method, system, device and readable storage medium for determining the open circuit position of a module. Background technique [0002] The integrated circuit board is used to transmit signals. It is a circuit component board that centralizes and mass-produces fixed circuits and plays an important role in electronic products. With the rapid development of electronic products, the quality requirements of circuit boards are also getting higher and higher. [0003] Modules are composed of integrated circuits to achieve applications in a certain direction, such as camera modules, monitoring modules, etc. The circuits in these modules are complex and numerous, and the current general open-short test can only confirm whether the module is open or short-circuited. If there is a line fault in the group, the specific location cannot be confirmed, and the fault point cannot be detected by X-rays...

AI Technical Summary

Problems solved by technology

[0003] Modules are composed of integrated circuits to achieve applications in a certain direction, such as camera modules, monitoring modules, etc. The circuits in these modules are complex and numerous, and the current general open-short test can only confirm whether the module is open or short-circuited. If there is a line fault in the group, the specific location cannot be confirmed, and the fault point cannot be detected by X-rays, so it is difficult to analyze the problem and confirm the cause of the fault

Images