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Integrated wiring board assembly

A technology of wiring substrates and joints, which is applied in the direction of electric solid-state devices, semiconductor devices, stacked printed circuit boards, etc., and can solve problems such as damage to the joint part, easy shrinkage of the flexible substrate 110, and disconnection

Active Publication Date: 2018-01-19
NGK INSULATORS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, there are cases where the left and right sides of the flexible substrate 110 tend to be curled (refer to Figure 9 Arrows), so that the junction between the contacts arranged on the left and right ends of the contact pattern 114 and the contact pattern 124 is damaged and the wire is broken.

Method used

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  • Integrated wiring board assembly
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Embodiment Construction

[0025] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. figure 1 is a cross-sectional view showing a schematic configuration of the plasma processing apparatus 10, figure 2 It is a perspective view showing the internal structure of the plate heater 30 .

[0026] Such as figure 1 As shown, a plasma processing apparatus 10 as a semiconductor manufacturing apparatus includes a vacuum chamber 12 , a shower head 14 , and an electrostatic chuck heater 20 . The vacuum chamber 12 is a box-shaped container formed of aluminum alloy or the like. The shower head 14 is disposed on the top surface of the vacuum chamber 12 . The shower head 14 discharges the processing gas supplied from the gas introduction pipe 16 into the vacuum chamber 12 through a plurality of gas injection holes 18 . In addition, the shower head 14 functions as a cathode plate for generating plasma. The electrostatic chuck heater 20 is a device for suc...

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Abstract

The invention provides an integrated wiring board assembly. A connection FPC 75 and a sheet heater 30 are joined together with a solder joint member interposed therebetween. The connection FPC 75 includes a ground contact point 90b and a connection electrode 90d extending along a row of contact points and to which the ground contact point 90b is connected. The connection electrode 90d extends beyond both ends of the row. The sheet heater 30 includes a ground land 46b and a connection land 46d extending along a row of lands and to which the ground land 46b is connected. The connection land 46dextends beyond both ends of the row.

Description

technical field [0001] The present invention relates to a wiring board assembly. Background technique [0002] Conventionally, as a wiring substrate bonded body of a flexible substrate and a printed circuit board, a bonded body in which a contact portion such as a contact pattern on a flexible substrate is electrically connected to a corresponding contact portion on a printed circuit board by soldering is known (for example, Patent Document 1 ). An example of such a wiring board assembly is shown in Figure 9 . In the flexible substrate 110 , the cover film 112 is removed at the substrate end, so that the ends of the copper foil patterns arranged in parallel at a constant pitch are exposed as contact patterns 114 . Then, the contact pattern 114 is overlaid on the contact pattern 124 formed on the printed circuit board 120 , and the solder preliminarily attached to at least one surface of the contact pattern 114 and the contact pattern 124 is melted to perform electrical co...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67109H01L21/6833H05K1/0209H05K1/0215H05K1/118H05K2201/09381H01L21/67103H05K1/0212H05K1/028H05K3/363H05K2201/041H01L21/185H01L21/324H01L24/26H01L21/67092H01L2021/60007H01L21/67069H01L21/6831H05K1/144
Inventor 竹林央史
Owner NGK INSULATORS LTD
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