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A processing device for processing anti-pinch grooves of ultra-thin diamond cutting discs

A diamond cutting and processing device technology, applied in the field of electrolytic grinding, to achieve the effect of good double-sided symmetry, high precision, and low loss

Active Publication Date: 2019-11-01
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing electrolytic grinding devices are mainly suitable for thin-walled, single-sided processing, and the device for simultaneously opening concave shallow grooves on both sides of thin-walled disc-shaped workpieces has not been reported.

Method used

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  • A processing device for processing anti-pinch grooves of ultra-thin diamond cutting discs
  • A processing device for processing anti-pinch grooves of ultra-thin diamond cutting discs
  • A processing device for processing anti-pinch grooves of ultra-thin diamond cutting discs

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Embodiment Construction

[0035] Combine below Figure 1 to Figure 4The implementation of the present invention is further described in detail: a processing device for processing ultra-thin diamond cutting blade anti-pinch grooves, including a motor 19, a shaft coupling 18, a rotating shaft 14, a bearing-bearing seat assembly 13, a bearing- Bearing housing assembly 15, grinding head chuck 6 and grinding rotation unit of conductive grinding head 2, fixed platform 25, electrolysis power supply 30, nozzle 31 and workpiece containing workpiece 1, rotating spindle 26, chuck body 27, lock nut 28 The clamping unit is characterized in that it also includes a conductive grinding head moving guide unit including a front guide rail 4, a rear guide rail 20, a front slider 5, a rear slider 16, and a slider connecting plate 17, and includes a two-way lead screw 10, a wire Grinding of rod fixing seat 7 and lead screw fixing seat 22, hand wheel 8, left-handed nut seat 21, right-handed nut seat 9, light rod 23, light r...

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Abstract

The invention discloses a machining device used for machining an anti-clamp groove of an ultrathin diamond cutting piece. The machining device comprises a workpiece clamping unit, an electrolytic power supply, spraying nozzles, an electrolytic circulation filter unit, a conductive grinding head moving guide unit, a grinding rotation unit, a fixed platform and a grinding force loading unit; a workpiece is connected to an anode of the electrolytic power supply, the two conductive grinding heads are connected with a cathode of the electrolytic power supply, and the two conductive grinding heads are symmetrically arranged on both sides of the workpiece; and four springs with the same specification are adopted to apply same flexible pressing force to the left conductive grinding head and the right conductive grinding head, the two spraying nozzles are mounted on the inclined upper portion of the tangent position of the two conductive grinding heads and the workpiece, and circulating electrolyte supplying is conducted through the electrolytic circulation filter unit. According to the machining device used for machining the anti-clamp groove of the ultrathin diamond cutting piece, machining of the double-face annular anti-clamp groove is achieved through the machining mode of simultaneous rotating of the workpiece and the two conductive grinding heads, the machining precision and thesurface quality of the anti-clamp groove are improved, symmetry of the anti-clamp groove is better, and the machining efficiency of the workpiece is higher.

Description

technical field [0001] The invention relates to a processing device for processing an anti-pinch groove of an ultra-thin diamond cutting blade, which belongs to the field of electrolytic grinding processing. Background technique [0002] Due to the advantages of narrow groove, smooth fracture, high cutting efficiency and low scrap rate, ultra-thin diamond cutting discs are widely used in cutting hard and brittle materials and other precious materials in the world. However, the ultra-thin diamond cutting disc, on the one hand, has a thin thickness (generally no more than 1mm), relatively weak heat capacity and load-bearing capacity, and limited deformation resistance; on the other hand, its slit is very narrow during work, and the heat It is not easy to spread, and the product is not easy to get rid of, so that in the application process, thermal deformation, knife clamping, burns, chipping, cracking and other phenomena often occur. Research has found that opening grooves (a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H5/08
CPCB23H5/08
Inventor 明平美申继文秦歌闫亮郑兴帅陈伟张新民杨文娟
Owner HENAN POLYTECHNIC UNIV
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