Miniature asymmetric surface mounted fuse and manufacturing method thereof

Abstract

The invention discloses a miniature asymmetric surface mounted fuse comprising a melt plate of which the top surface is pasted by melt, cavity plates which comprise a first cavity plate equipped witha first cavity and a second cavity plate equipped with a second cavity, an upper substrate which is laminated on the first cavity plate and a lower substrate which is laminated below the second cavityplate, end electrodes which are arranged on the substrates and / or the cavity plates and electrically connected with the melt and elastic material which fills in the second cavity plate. The inventionalso provides a manufacturing method of the miniature asymmetric surface mounted fuse. According to the miniature asymmetric surface mounted fuse, the elastic material elastically supports the melt plate so that the surface mounted fuse with arrangement of single layer fuse wires of simpler technology and processing mode is enabled to achieve the fuse level of the surface mounted fuse with arrangement of multilayer fuse wires.

Description

technical field [0001] The invention relates to the field of electronic protection components, and in particular provides a miniature asymmetrical surface mount fuse and a manufacturing method thereof. Background technique [0002] With the development of modern electronic technology, portable modern electronic devices have entered thousands of households from mobile phones, notebook computers to tablet computers. Prepare weapons. Recently, major safety accidents such as battery explosion, charging overheating, charger smoke and fire or even fire have occurred frequently, and the requirements for safety design specifications of batteries and chargers are getting higher and higher. As a secondary protection component, how to play a safe and reliable protective role in electronic circuits is closely related to the characteristics of the fuse. Fixed device type fuses and hollow type fuses are the two main types of small surface mount fuses. [0003] Fixed device type fuses i...

AI Technical Summary

Problems solved by technology

But this design also has significant defects: first, the fuse is located in the middle of the product, and the electrodes on the surface are connected by electroplating, but the expansion coefficient of the substrate of the through hole wall of the circuit board material is relatively large, which is higher than that of the plated metal. Under higher temperature conditions, the plating metal will be peeled off from the base material, which will cause the fuse to be stretched or even broken, making it impossible to produce products with lower specifications; secondly, the fuse is exposed in the through hole, which is not fixed and is easy to be broken Injury, resulting in poor connectivity between fuses and fuses, thus affecting product performance

[0005] Chinese patent 2016203249650 changed the fuse to the fuse layer on the basis of the second type, which solved the problem of poor connection of the second type of fuse

[0006] 1) If a double-sided or multi-layer fuse design is used, the design of the double-sided fuse must be nearly the same as possible. Otherwise, under high breaking conditions, if the energy is unbalanced when the two sides are broken, the fuse layer will burst and cause the product to fail. Abnormal; there is also a multi-layer fuse design that separates a single cavity into multiple, which makes it troublesome to fill the cavity and the operation process is complicated

2) If a single-sided fuse design is adopted, the back of the fuse is a solid substrate, and when the high breaking point is high, a counter-impact force is generated on the fuse to transmit the back of the fuse layer, and the solid substrate has no buffer, which will directly cause the fuse to break. layer burst, resulting in worse breaking capacity for this design than double layer fuses

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