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Electrostatic chuck and repair method

An electrostatic chuck and electrode technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as etching damage of lifting pin holes

Active Publication Date: 2021-10-08
LK ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the process of processing the object is repeated, the lift pin hole will be damaged by etching

Method used

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  • Electrostatic chuck and repair method
  • Electrostatic chuck and repair method
  • Electrostatic chuck and repair method

Examples

Experimental program
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Effect test

Embodiment Construction

[0024] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

[0025] figure 1 It is an exploded cross-sectional view of an electrostatic chuck according to an embodiment of the present invention. figure 2 It is a combined cross-sectional view of an electrostatic chuck according to an embodiment of the present invention.

[0026] refer to figure 1 and figure 2 , according to an embodiment of the electrostatic chuck 10 may include a lower plate 110 , an upper plate 120 and an electrode 140 .

[0027] The board assembly can be constituted by combining the lower board 110 and the upper board 120 in which the electrode 140 is embedded. In addition, the board assembly may be bonded to a base (not shown). For example, the base may be formed from a metallic material.

[0028] A plurality of pin holes 130 may be formed at predetermined positions of the lower plate 110 so as to penetrate the lower plate 110 in the insta...

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PUM

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Abstract

An electrostatic chuck according to an embodiment of the present invention may include: a lower plate, a plurality of pin holes are formed at specified positions in such a way as to penetrate the upper surface in a vertical direction from the upper surface, and a height having a specified depth from the upper surface is formed on the outer periphery. difference part; and an upper plate, which is fastened and combined with the above-mentioned upper surface of the above-mentioned lower plate, including a flat plate portion, a side portion and a pin hole protection portion, the above-mentioned flat portion is combined with the above-mentioned upper surface of the above-mentioned lower plate, and the above-mentioned side portion and the above-mentioned height The difference parts are combined, the above-mentioned pin hole protection part is fastened and combined in the above-mentioned pin hole, and the electrodes are formed on the above-mentioned upper plate in a surrounded structure.

Description

technical field [0001] The present invention relates to a semiconductor manufacturing device, and more specifically, to an electrostatic chuck and a repair method. Background technique [0002] In order to manufacture a semiconductor element or a flat panel display device, various processes are performed in a state where a substrate support table in a vacuum chamber absorbs and supports a substrate. [0003] As an example, the substrate support table may be an electrostatic chuck (ESC, Electrostatic Chuck). An electrostatic chuck is a device that uses electrostatic force to support a substrate on a lower electrode within a chamber. [0004] Generally, an electrostatic chuck may include a base, a plate fixedly coupled to the base, and an electrode (lower electrode) formed inside the plate. On the upper face of the board a substrate can be placed. [0005] Static electricity is generated on the lower electrode to maintain a constant distance between the substrate and the lo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/6833H01L21/6831H01L21/6835H01L21/68742
Inventor 李濬豪金南出刘载硕
Owner LK ENG CO LTD