Light-emitting diode flip-chip die and display
A technology of light-emitting diodes and Jingjing, which is applied in the field of displays and light-emitting diode flip-chip grains. It can solve the problems of light-emitting diode light wavelength offset, high luminous power, and affecting the light-emitting effect of light-emitting diodes, so as to improve the quality of light emission and heat dissipation. , to avoid the effect of light wavelength shift
Inactive Publication Date: 2020-03-17
ZHANJING TECH SHENZHEN +1
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The luminous power of the flip-chip LED is high, and the heat generated when emitting light is also large. If the heat dissipation is not good, the wavelength of the light generated by the LED will shift, which will affect the luminous effect of the LED.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0048] Please refer to figure 1 A preferred embodiment of the present invention provides a flip-chip die 100 for a light emitting diode, which includes a flip-chip die 10 and a heat dissipation and light-absorbing layer 20 bonded to the side of the flip-chip die 10 . The heat dissipation and light absorbing layer 20 is used to absorb the light emitted from the side of the flip-chip die 10 and dissipate the heat generated by the flip-chip die 10 .
[0049] The heat-dissipating and light-absorbing layer 20 is made of graphite, diamond-like carbon, silica gel, and other materials that have both light-absorbing and heat-dissipating functions. The heat-dissipating and light-absorbing layer 20 can avoid the wavelength shift of the light emitted by the flip-chip die 10 due to poor heat dissipation, thereby improving the luminous quality of the flip-chip die 100 of the LED. The heat dissipation light-absorbing layer 20 is coated on the side of the flip-chip die 10 by glue coating tec...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A light-emitting diode flip-chip grain, which includes a flip-chip grain and a heat dissipation and light-absorbing layer combined with the side surface of the flip-chip grain. The light-emitting diode flip-chip die includes a heat dissipation and light-absorbing layer arranged on the side of the flip-chip die. The heat dissipation and light-absorbing layer can absorb the light emitted from the side of the flip-chip die, and can also dissipate the heat generated by the flip-chip die. In this way, the heat dissipation of the flip-chip die can be improved, and the wavelength shift of the emitted light caused by the flip-chip die due to poor heat dissipation can be avoided, thereby improving the luminous quality of the flip-chip die of the light-emitting diode. In addition, the present invention also provides a display using the light-emitting diode flip chip.
Description
technical field [0001] The invention relates to a light-emitting diode flip-chip grain and a display using the light-emitting diode flip-chip grain. Background technique [0002] With the continuous development of the LED industry, flip-chip light-emitting diodes are gradually replacing conventional light-emitting diodes due to their advantages such as small package size and large light-emitting area, and are widely used in the LED lighting industry. [0003] Flip-chip LEDs have higher luminous power and generate more heat when emitting light. If the heat dissipation is not good, the wavelength of the light generated by the LEDs will shift, affecting the luminous effect of the LEDs. Contents of the invention [0004] In view of this, it is necessary to provide a light-emitting diode flip-chip chip with better heat dissipation effect to solve the above-mentioned problems. [0005] In addition, it is also necessary to provide a display using the above light-emitting diode f...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/44H01L33/64H01L25/075
CPCH01L25/0753H01L33/44H01L33/641H01L2933/0025H01L2933/0075H01L33/20H01L33/382H01L33/08H01L33/387H01L33/62
Inventor 沈佳辉洪梓健彭建忠黄建翔黄世晟刘芝蓉
Owner ZHANJING TECH SHENZHEN