A method for making thin-film circuit gold-tin alloy pads
A technology of thin-film circuits and tin alloys, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of difficult mass production, poor product yield, and low process controllability, so as to improve the low yield , improved yield and high process controllability
Active Publication Date: 2019-09-24
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a method for manufacturing a gold-tin alloy pad for thin film circuits with high productivity in view of the above-mentioned problems, so as to improve the existing products with high production cost and large batch production difficulty. Low process controllability, poor product yield and other issues
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0026] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.
[0027] Any feature disclosed in this specification, unless specifically stated, can be replaced by other alternative features that are equivalent or have similar purposes. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.
[0028] The method for making thin-film circuit gold-tin alloy pad that the present invention adopts is as figure 1 shown, including:
[0029] Step 1, the prefabricated gold-tin pads of the sandwich structure are produced by the alternate coating process such as figure 2 As shown: an Au film layer is deposited on the surface of the metallized ceramic substrate 1-1 by sequentially sputtering the transition layer 1-2 and the metal seed layer 1-3 as the pad bottom layer 1-4. Both the sputtering coatin...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| melting point | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a method for manufacturing a thin film circuit gold-tin alloy bonding pad, and relates to a method for manufacturing the thin film circuit gold-tin alloy bonding pad by adoptingan alternate coating technology. The objective of the invention is to solve the problem in the prior art, the high-productibility manufacturing method for the thin film circuit gold-tin alloy bondingpad is provided so as to improve the problems of high production cost, high difficulty for volume production, low technology controllability, relatively low rate of finished products and the like existing in an existing method. The technical key points of the method comprise a prefabricated gold-tin bonding pad of a sandwich structure is manufactured by adopting the alternate coating technology,a solder resist structure of the bonding pad is manufactured and the alloying bonding pad is prefabricated.
Description
technical field [0001] The invention relates to a method for manufacturing a gold-tin alloy pad for a thin film circuit, in particular to a method for manufacturing a gold-tin alloy pad for a thin film circuit by an alternate coating process. It is suitable for the production of automatic assembly modules and high-precision stacked ceramic thin film circuits in the fields of radio frequency and optical communication. Background technique [0002] In the traditional integration process, the method of artificially placing alloy sheets is usually used for eutectic. However, as the demand for products increases, the prefabrication technology of gold-tin alloy pads for thin-film circuits has gradually become a research hotspot in cutting-edge fields such as radio frequency and optical communications. This is because: on the one hand, the continuous improvement of product integration requirements promotes the development of packaging technology in a three-dimensional direction, an...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/60
Inventor 李彦睿王春富秦跃利王春晖
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP