Wafer coordinate reading device and method

Abstract

The invention discloses a wafer coordinate reading device and method. The wafer coordinate reading device comprises a carrying disc, a tray, a microscope body and a visual device, wherein the tray isplaced on the carrying disc, the microscope body is arranged above the carrying disc, the tray is placed at one side of the carrying disc and is used for bearing a wafer, a coordinate graph is formedat the other side of the carrying disc, is corresponding to the wafer and is provided a plurality of square regions, the plurality of square regions are in one-to-one correspondence to a plurality ofgrains of the wafer and have same sizes with the plurality of grains of the wafer, and each square region is marked with a coordinate value corresponding to the grain. When the coordinate corresponding to the grain is needed to be read, the wafer and the coordinate graph are arranged in the same direction, light of the microscope body and a light ray of the visual device respectively irradiate corresponding positions of the wafer and the coordinate graph all the way, the corresponding grain is moved to a part right below the light of the microscope body by moving the carrying disc, and the square region on the coordinate graph and corresponding to the grain is correspondingly moved to a part right below the light ray of the visual device.

Description

technical field [0001] The invention relates to the field of wafer detection, in particular to a wafer coordinate reading device and method. Background technique [0002] At present, when wafers are inspected under a microscope, if defective products are found, these defective products are usually directly marked with ink dots. However, after ink dots are applied to these defective products, in the subsequent process, It is often easy to cause pollution to other good products around, and then affect the quality of the product. Because of this, some manufacturers identify defective products by modifying the corresponding MAP diagram. On the MAP diagram, each coordinate value corresponds to a die, but the coordinate value of the MAP diagram can only be seen on the testing machine. Therefore, with this method, even if only one defective product is found, it will take a lot of time to deal with it, and it will delay the normal operation of the testing machine and reduce the uti...

AI Technical Summary

Problems solved by technology

[0002] At present, when wafers are inspected under a microscope, if defective products are found, these defective products are usually directly marked with ink dots. However, after these defective products are marked with ink, in the subsequent process, It is often easy to cause pollution to other good products around, thereby affecting the quality of the product

Because of this, some manufacturers identify defective products by modifying the corresponding MAP diagram. On the MAP diagram, each coordinate value corresponds to a die, but the coordinate value of the MAP diagram can only be seen on the testing machine. Therefore, with this method, even if only one defective product is found, it will take a lot of time to deal with it, and it will delay the normal operation of the testing machine and reduce the utilization rate of the equipment.

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