An electrostatic chuck and semiconductor processing device

Abstract

The invention provides an electrostatic chuck and a semiconductor processing apparatus. The electrostatic chuck comprises an electrostatic chuck substrate and an ejector pin assembly arranged in the electrostatic chuck substrate; the ejector pin assembly can perform uprising and declining to lift up and put down a wafer on the electrostatic chuck substrate; the ejector pin assembly comprises ejector pins which are in regular triangular distribution with different sizes on the edge region and the central region of the electrostatic chuck substrate; and the center of the regular triangular correspondingly coincides with the center of the electrostatic chuck substrate. By virtue of the electrostatic chuck, applied force on the wafer can be dispersed effectively when the wafer has no positionoffset relative to the electrostatic chuck substrate and when the bonding wafer has certain centre-of-gravity offset within a certain range relative to the electrostatic chuck substrate, so that the gravity of the wafer is still equal to the combined force of the ejector pin assembly which forms effective supporting for the wafer, thereby ejecting the wafer stably and avoiding inclination of the wafer; and therefore, it is ensured that a mechanical arm can smoothly take off the wafer from the electrostatic chuck, and smooth implementation of the subsequent process also can be ensured.

Description

technical field

[0001] The invention relates to the technical field of semiconductor device preparation, in particular to an electrostatic chuck and a semiconductor processing device. Background technique

[0002] At present, solid-state image sensors have been widely used, and there are two different design structures: CCD (Charge Coupled Image Sensor) and CMOS (Complementary Metal-Oxide Semiconductor Image Sensor). Compared with CCD, CMOS can provide better image quality, and can make imaging components and processing electronic components in the same chip die, with small size, low power consumption and simple assembly. Therefore, various optical lenses are mainly used at present. is a CMOS image sensor.

[0003] The composition of CMOS is mainly a glass layer and a silicon layer, with a chip layer in between. The main way to package CMOS devices is to use wafer-level packaging. The solution widely adopted in the industry is to use TSV (through silicon via, through silic...

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