37results about How to "Reduce the probability of tilt" patented technology

The invention relates to a periscope for pipeline detection. The periscope includes a telescopic rod, a periscope main machine installed at the lower end of the telescopic rod and amounting base erected on the ground; a blocking piece is arranged on the peripheral side of the telescopic rod and located on the side, away from the periscope main machine, of the mounting base; a through hole for thetelescopic rod to penetrate through is formed in the mounting base; a groove coaxial with the through hole is formed in one side, facing the upper end of the telescopic rod, of the mounting base; theperipheral wall and bottom of the groove are each provided with a first magnet; the side, toward the groove, of the blocking piece and the peripheral wall of the blocking piece are each provided witha third magnet which is opposite to the first magnet in polarity, so that the blocking piece is suspended in the groove. The periscope provided by the invention has the effect of improving the qualityof the camera data acquired by a camera.

The invention provides a transmission device and semiconductor processing equipment. The transmission device is used for assembling or disassembling a wafer on a static chuck, and comprises a centre lifting mechanism which comprises a plurality of centres and a lifting driver, wherein each centre passes through the upper and lower surfaces of the static chuck. The lifting driver is used for driving each centre to rise or fall in the static chuck, so as to enable the wafer on the static chuck to be jacked up or enable the wafer on the centres to be placed on the static chuck. The plurality of centres are arranged to be corresponding to the edge region of the static chuck. There are first preset gaps between the plurality of centres and the edge of the static chuck in a radial direction of the static chuck. The transmission device can reduce the probability that the wafer is caused to be inclined because of wafer adhering to great degree, so the transmission device can protect the wafer from being deflected or smashed, can improve the stability and reduces the requirements for the absorption capability of the static chuck.

The invention relates to a laser spot welder and a range hood production process applying the laser spot welder, and relates to the technical field of welding equipment. The laser spot welder comprises a machine frame; a laser, an observation mechanism and a moving mechanism are arranged on the machine frame; a worktable is arranged on the moving mechanism; a clamping mechanism is arranged on theworktable; the clamping mechanism comprises a fixed frame mounted on the worktable; two moving seats are arranged on the fixed frame in a sliding manner; a first clamping block is mounted on the moving seat; a second clamping block is mounted on the moving seat in the sliding manner; space used for clamping a welding piece is formed between the opposite sides of the first clamping block and the second clamping block; a first driving component is arranged on the fixed frame; and a second driving component which is connected with the moving seat is arranged on the fixed frame. According to the laser spot welder and the range hood production process applying the laser spot welder, the welding piece is clamped through the first clamping block and the second clamping block so as to realize thefixation of the welding piece; the probability of a welding seam is reduced; the probability of welding missing when the laser performs welding is reduced; the welding quality is improved; and the defective rate is reduced.

The invention discloses a building outer wall construction platform. The building outer wall construction platform comprises a hollow base and a fence arranged at the upper end of the base and surrounding the base by a circle, one or more floating blocks are laid on the upper end face of the base side by side, the upper end face of each floating block is provided with a pedal, and the pedals at the adjacent ends are arranged in a butt joint mode side by side. A storage cavity is formed in the base, a material storage bag is arranged on the bottom face of the storage cavity, fluid construction materials are stored in the material storage bag, hollow cavities are formed in the two side faces of the base respectively, pressing plates are arranged at the bottoms of the floating blocks, feeding pipes are arranged at the bottoms of the pressing plates, one ends of the feeding pipes stretch into the material storage bag in a sealed mode, and the other ends of the feeding pipes are butted and communicated with a telescopic protective barrier. According to the construction platform, nearby following material taking can be achieved, the purpose of balancing the construction platform can be achieved, and the construction safety is improved.

The invention discloses a water pump water seal height detection device, which comprises a measurement mechanism and a correction mechanism, wherein the measurement mechanism comprises a holding tube and a dial indicator; the holding tube is internally provided with a first tube cavity and a second tube cavity; the tube diameter of the first tube cavity is larger than that of the second tube cavity; the testing head of the dial indicator is fixed in the second tube cavity; the first tube cavity is internally provided with a moving rod; one end of the moving rod reaches a top rod extending inside the second tube cavity to be contacted with the testing head of the dial indicator; and the correction mechanism comprises a step-shaped correction block. By adopting the structure and the method, the device and the method of the invention have the following advantages that a detection tool is positioned by adopting a shaft core, the contact area between the measurement block and the water seal surface is added, and the possibility that the detection tool tilts in the measurement process is reduced; and in the case of detection, the swinging scale of the dial indicator can be directly viewed straightly, and data can be intuitively, accurately and quickly read.

The application provides an integrated circuit package and its preparation method. The package includes: a chip, including a functional surface and a non-functional surface oppositely arranged, and a plurality of first pads arranged at intervals are arranged on the functional surface The substrate is arranged at a distance from the chip, and the substrate is provided with a second pad at a position corresponding to the first pad; a plurality of first soldering bodies, including a conductive support and at least one of the conductive supports The first solder layer at one end of one side, the first solder body is electrically connected between part of the first pad and the corresponding second pad; a plurality of second solder bodies, including the second solder layer, and the second soldering body is electrically connected between the remaining first pad and the corresponding second pad; wherein, the melting point of the conductive support is higher than that of the first solder layer and the first solder layer. The melting point of the second solder layer. Through the above method, the present application can reduce the probability of the chip being tilted relative to the substrate during reflow.

The invention provides an electrostatic chuck and a semiconductor processing apparatus. The electrostatic chuck comprises an electrostatic chuck substrate and an ejector pin assembly arranged in the electrostatic chuck substrate; the ejector pin assembly can perform uprising and declining to lift up and put down a wafer on the electrostatic chuck substrate; the ejector pin assembly comprises ejector pins which are in regular triangular distribution with different sizes on the edge region and the central region of the electrostatic chuck substrate; and the center of the regular triangular correspondingly coincides with the center of the electrostatic chuck substrate. By virtue of the electrostatic chuck, applied force on the wafer can be dispersed effectively when the wafer has no positionoffset relative to the electrostatic chuck substrate and when the bonding wafer has certain centre-of-gravity offset within a certain range relative to the electrostatic chuck substrate, so that the gravity of the wafer is still equal to the combined force of the ejector pin assembly which forms effective supporting for the wafer, thereby ejecting the wafer stably and avoiding inclination of the wafer; and therefore, it is ensured that a mechanical arm can smoothly take off the wafer from the electrostatic chuck, and smooth implementation of the subsequent process also can be ensured.

The invention discloses a cup containing object for catering. The cup containing object comprises a cup containing frame and a lifting handle; the cup containing frame comprises an upper ring plate, alower ring plate and middle connecting strips; the lifting handle sequentially passes through the upper ring plate and the middle connecting strips and then is hinged to the top surface of the lowerring plate; the upper ring plate and the lower ring plate are parallel to each other, upper ring openings are formed in the upper ring plate, lower ring openings are formed in the lower ring plate, and the number of the upper ring openings of the cup containing frame is one or two; and a heat dissipation facility is arranged under the cup containing frame. According to the design, the stability isrelatively good, the leakage is not prone to occurrence, moreover, the folding function is achieved, and the storage and the use are facilitated.

The application relates to a periscope for pipeline detection, which includes a telescopic rod, a periscope main body installed at the lower end of the telescopic rod, and a mounting seat erected on the ground; One side; the mounting seat is provided with a perforation for the telescopic rod to pass through; the side of the mounting seat facing the upper end of the telescopic rod is provided with a groove coaxially arranged with the perforation; the peripheral wall and the bottom of the groove are provided with a first magnetic block; The side of the blocking piece facing the groove and the peripheral wall of the blocking piece are provided with a third magnetic block which is opposite in polarity to the first magnetic block, so that the blocking piece is suspended in the groove. The application has the effect of improving the quality of the imaging data acquired by the camera.

The invention discloses an automatic cutting device for tarpaulin processing, which comprises a base and a tarpaulin. A support seat is arranged on the outside of the top of the base, and a first hydraulic pressure is connected to the side of the support seat close to the vertical center line of the base. The first hydraulic cylinder is provided with a slide seat near the vertical center line of the base, and the top outside of the slide seat is connected with a second hydraulic cylinder, and the top outside of the second hydraulic cylinder is provided with a clamping plate. In the automatic cutting device for tarpaulin processing, the driven runner can be fixed on the top plate of the workbench through the connecting plate, and the outer surface of the driven runner is attached to the outer surface of the tarpaulin. Through the sliding of the tarpaulin, it can drive The driven wheel rotates. There is a circle detector inside the driven wheel, and the number of circles of the circle detector can be adjusted. When the driven wheel turns a certain number of circles, the system will send a signal to the cutting machine. Knife, so that the cutting knife cuts the tarpaulin, which enables the equipment to automatically cut the tarpaulin into equidistant lengths.

The invention discloses a lifting frame of a water cup. The lifting frame comprises a cup containing frame and a lifting handle; the cup containing frame comprises an upper ring plate, a lower ring plate and middle connecting strips; the lifting handle sequentially passes through the upper ring plate and the middle connecting strips and then is hinged to the top surface of the lower ring plate; the upper ring plate and the lower ring plate are parallel to each other, upper ring openings are formed in the upper ring plate, lower ring openings are formed in the lower ring plate, and the number of the upper ring openings of the cup containing frame is one or two; and a heat dissipation facility is arranged under the cup containing frame. According to the design, the stability is relatively good, the leakage is not prone to occurrence, moreover, the folding function is achieved, and the storage and the use are facilitated.

The invention discloses an energy-saving prefabricated building wall, comprising two outer walls and a temperature conduction area formed by clamping the two outer walls, a plurality of first temperature conduction blocks are arranged on the outer walls, and the first temperature conduction block includes a first connection part , the first connection part is at least partially located in the temperature conduction area; a plurality of second temperature conduction blocks are arranged in the temperature conduction area, the two ends of the second temperature conduction block respectively include second connection parts, and the second temperature conduction block can move and move The second connection part can be brought into contact with the corresponding first connection part; the first connection part and the second connection part are both comb-shaped, and the movement of the second temperature guide block can make the second connection part and the corresponding first connection part layer Layer staggered conflict. The invention realizes indoor and outdoor temperature adjustment through the relative moving contact between the second temperature guide block and the first temperature guide block, adopts a partial moving method, and has low weight, so that the required moving force is small, the movement is convenient and labor-saving, and the vibration and noise are small. Suitable for home environment.

The invention relates to a method for precontrolling the sink and oblique of an open caisson, which is characterized by comprising the following steps: constructing 4-10 support stakes and fixing steel structure pillars on the top thereof; suspending the open caisson construction before the open caisson construction goes into the soil horizon where open caisson oblique is prone to appear; digging out the 4-10 steel structure pillars to a place which is 1-3.5 meters below the upper surface of the soil horizon where open caisson oblique is prone to appear, taking out the earthwork below the wall of the open caisson into which 2-6 support beams will stick, fixing the support beams on the steel structure pillars, and then putting the ends of the 2-6 support beams into the part under the wall of the open caisson; then beginning the open caisson construction till the open caisson goes down to the support beams; leveling and controlling the open caisson every time when the open caisson sinks for a certain section; not stopping until the lower end of the open caisson wall goes down to the bottom designed elevation of the open caisson; then removing the support beams, steel column and support piles. The method has the advantage of greatly decreasing the incline occurrence probability of open caissons.

The invention discloses a photoelectric IC output optical switch which comprises a PCB, a photoelectric IC output optical switch body, a top end clamping module, a bottom end clamping module and a connecting plate. The upper surface of the PCB is in lap joint with the photoelectric IC output optical switch body. According to the invention, the top end clamping module is arranged; the width direction of the photoelectric IC output optical switch can be clamped; the perpendicularity of the photoelectric IC output optical switch in the width direction is ensured; the bottom end clamping module isarranged; the length direction of the photoelectric IC output optical switch can be clamped; the perpendicularity of the photoelectric IC output optical switch in the length direction is ensured; theperpendicularity of the photoelectric IC output optical switch in the X-axis direction and the Y-axis direction is ensured; and the parallelism between the bottom surface of the photoelectric IC output optical switch and the upper surface of the PCB is ensured, so that the inclination probability of the photoelectric IC output optical switch during surface mounting is reduced, and the cold solderjoint phenomenon of the photoelectric IC output optical switch in a reflow process is reduced.

The invention relates to a numerical control plate shearing and blanking machine which comprises a mounting frame, supporting legs, a placing plate, a placing shaft, a leveling mechanism, a conveying mechanism and a plate shearing mechanism. The machine can solve the problems that it is difficult to carry out continuous uniform transmission of steel coil in the operation that a plate shearing machine performs plate shearing operation, burrs and chippings on the two sides of a steel coil are difficult to remove synchronously in the steel coil conveying process, the overall cleaning degree of the steel coil is reduced, multidirectional limiting supporting is also difficult to conduct on the steel coil, the probability that the steel coil deflects and shakes is increased, the removing efficiency of burr removing operation is reduced, the front side and the rear side of the steel coil shearing part are difficult to clamp and support at the same time, the probability that the steel coil shearing part is wrinkled and inclined is increased, and the flatness degree of a notch of the steel coil shearing part is reduced.

The invention discloses a fetching device of a fast food cup. The fetching device comprises a cup holding frame and a lifting handle, wherein the cup holding frame comprises an upper ring plate, a lower ring plate and a middle connecting strip; the lifting handle sequentially passes through the upper ring plate and the middle connecting strip and is hinged with the top surface of the lower ring plate; the upper ring plate and the lower ring plate are mutually parallel; an upper ring opening is formed in the upper ring plate and a lower ring opening is formed in the lower ring plate; one or twoupper ring openings are formed in the cup holding frame; and a heat radiating facility is arranged in the cup holding frame. The fetching device, through the design, is relatively good in stability and is capable of preventing easy spillage; and moreover, the fetching device has a folding function and is beneficial for preservation and application.

The invention relates to an assembled skirting line structure, and belongs to the technical field of skirting line installation. The assembled skirting line structure comprises a plurality of skirting line bodies, the bottom end of a wall surface is horizontally connected with a plurality of connecting blocks in a sliding manner, dovetail strips are horizontally fixed at the bottom end of the wall surface, dovetail grooves are formed in the side walls, directly facing the wall surface, of the connecting blocks, the dovetail strips are located in the dovetail grooves, and reinforcing assemblies enabling the dovetail strips and the wall surface to be firmer are arranged between the dovetail strips and the wall surface; positioning assemblies for fixing the connecting blocks at specified positions on the dovetail strips are arranged between the connecting blocks and the dovetail strips; inserting grooves are formed in the side walls, away from the wall surface, of the connecting blocks, the side walls, directly facing the wall surface, of the skirting line bodies are the back surfaces and are fixedly connected with inserting plates, the inserting plates are inserted into the inserting grooves, and fixing assemblies for fixing the inserting plates into the inserting grooves are arranged between the connecting blocks and the inserting plates; and the front surfaces of the skirting line bodies on the same wall surface are coplanar. The skirting line structure has the effect of improving the firmness degree of the skirting line and the wall surface.

The invention discloses an anti-seismic reinforcement method for energy-saving transformation of existing building structures. The anti-seismic reinforcement is realized through the following reinforcement structure, which includes frames arranged on both sides of the building wall and vertical plates arranged outside the frame. A top plate is installed on the top of the vertical plate, and the middle of the top plate is threadedly connected with a pipe body. The lower end of the pipe body is inserted into the building wall. There are more than one positioning openings on both sides of the top plate. Screw rods are installed on the top surface facing the through holes, the screw rods are mounted on the positioning block through nuts, metal mesh is installed inside the frame body, and more than one extruding mechanism is installed on the vertical plate. The present invention can share the weight of the wall through the pipe body, the top plate, the vertical plate and the base, and can also support the wall, which greatly reduces the degree of settlement. The frame can be pressed inward to straighten the wall, reducing the inclination High rate, the metal mesh can effectively block the falling of bricks or large concrete blocks in the wall, increasing safety.

The invention provides an integrated circuit packaging body and a preparation method thereof. The packaging body comprises a chip which comprises a functional surface and a non-functional surface which are oppositely arranged, and the functional surface is provided with a plurality of first bonding pads which are arranged at intervals. The packaging body further comprises a substrate, wherein thesubstrate and the chip are oppositely arranged at intervals. A second bonding pad is arranged at the position, corresponding to the first bonding pad, of the substrate. The packaging body further comprises a number of first welding bodies. Each first welding body comprises a conductive supporting piece and a first welding flux layer at least located at the end of one side of the conductive supporting piece, and the first welding bodies are electrically connected between part of the first bonding pads and the corresponding second bonding pads. The packaging body further comprises a number of second welding bodies which comprise second welding flux layers, and the second welding bodies are electrically connected between the remaining first bonding pads and the corresponding second bonding pads. The melting point of the conductive supporting pieces is greater than the melting points of the first welding flux layer and the second welding flux layer. According to the invention, the probability that the chip inclines relative to the substrate during backflow can be reduced.