High-precision part packaging mechanism

Abstract

The present invention discloses a high-precision part packaging mechanism. The high-precision part packaging mechanism comprises a packaging mechanism main body and silver pins, and the silver pins are arranged at left and right sides of the packaging mechanism main body; the silver pins are embedded in the packaging mechanism main body, the packaging mechanism main body is internally provided with a heat sink, the heat sink is embedded in the packaging mechanism main body, the packaging mechanism main body is internally provided with a waterproof layer, a connection lead waterproof gasket isarranged at a connection position of a connection lead and a chip, the waterproof layer is arranged at the internal portion of the packaging mechanism main body to allow the internal portion of the packaging mechanism main body to be isolated from the outside, and therefore, the high-precision part packaging mechanism can effectively prevent water from entering a circuit board when the circuit board is carelessly fell into the water, the connection lead waterproof gasket allows the connection position of the connection lead and the chip to have a waterproof function, and the waterproof layer and the connection lead waterproof gasket are cooperated to allow the chip to be safely isolated at the internal portion of the packaging mechanism main body.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a packaging mechanism for high-precision parts. Background technique [0002] The so-called "packaging technology" is a technology of packaging integrated circuits with insulating plastic or ceramic materials. Taking CPU as an example, the actual volume and appearance seen are not the size and appearance of the real CPU core, but the CPU core, etc. For products after components are packaged, packaging technology packaging is necessary and crucial for chips, because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the one hand, the packaged chip is also easier to install and transport, because the quality of the packaging technology also directly affects the performance of the chip itself and the design and manufacture of the PCB (printed circuit board) connected t...

AI Technical Summary

Problems solved by technology

[0003] However, the existing packaging mechanism for high-precision parts generally does not have a waterproof structure inside, so that when the circuit board is accidentally wet with water, it is easy for liquid to invade the inside of the chip, resulting in damage to the chip, and the existing packaging mechanism is due to poor packaging. Perfection can easily cause the chip to be subject to external interference such as magnetic fields and signals, which will affect the operation of the chip and reduce the operating speed of the chip, which is difficult to meet the needs of modern people.

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