Design method for solving problem of falling off PAD from connector

A design method and connector technology, applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., to achieve the effect of increasing production capacity, large economic benefits, and saving cost resources

Inactive Publication Date: 2018-03-20
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical task of the present invention is to provide a design method to solve the problem of the PAD of the connector. By increasing the design of the copper foil area of ​​the Pin pin, the tensile force of the PAD is strengthened, and then the scrapping of the board caused by the PAD being pulled out is solved. problems, to ensure product yield

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0011] The present invention will be further described below in conjunction with specific examples.

[0012] A design method to solve the problem of missing PAD of the connector. For the PCB Layout next to the connector, without changing the size of the leaking PAD, the tensile force of the PAD is strengthened by increasing the copper foil area of ​​the Pin; The area of ​​the copper foil is at least twice the area of ​​the PAD. Since the size of the PAD cannot be changed arbitrarily, due to the influence of SMT soldering process factors, it cannot be increased or decreased at will. Only the area of ​​copper foil is increased, and the size of the leaked PAD is the same as before, but the increased area of ​​copper foil is covered by green oil. cover. In this way, even if the connector is knocked off due to external force, due to the large copper foil area and strong tensile strength, it will prevent the PAD from being pulled up, causing the board to be scrapped.

[0013] In t...

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PUM

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Abstract

The invention discloses a design method for solving the problem of connector dropping PAD, which belongs to the technical field of PCBA boards. For the PCB Layout next to the connector, without changing the size of the leaking PAD, the design method is to increase the copper foil area of ​​the Pin pin , to strengthen the tensile strength of the PAD; the width of the pin copper foil is at least twice the width of the PAD, and the length of the pin copper foil is at least 1.2 to 1.5 times the length of the PAD. The present invention is applicable to all boards with such similar connectors, and effectively solves the problem of the PAD of the connector being dropped, as well as maintenance costs, board scrapping costs, and labor costs caused by this defect.

Description

technical field [0001] The invention relates to the technical field of mobile phone PCBA boards, in particular to a design method for solving the problem of connector dropping PAD. Background technique [0002] At present, the connectors of existing products often have PADs (pads on the PCB) due to collision problems, resulting in board scrapping, and sometimes the defect rate is as high as 2%. After confirmation and analysis, this kind of connector itself is quite special. For example, the part body is small and the height is relatively high. During the process of plugging and unplugging or transportation, it is easy to cause parts to fall due to collisions, and may cause the PCB PAD to fall off, resulting in board failure. Card scrapped. Contents of the invention [0003] The technical task of the present invention is to provide a design method to solve the problem of the PAD of the connector. By increasing the design of the copper foil area of ​​the Pin pin, the tensil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3426H05K2201/1075
Inventor 张小行
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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