Touch lead structure and manufacturing method thereof
A technology for touch leads and manufacturing methods, which is applied in the direction of instruments, electrical digital data processing, and input/output processes of data processing, etc., and can solve problems such as poor adhesion between metal and insulating layer 13, easy warping, and reduced product yield, etc. question
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[0024] In order to further explain the technical means and effects adopted by the present invention to achieve the intended invention purpose, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0025] figure 2 It is a schematic top view of the touch lead structure in an embodiment of the present invention. image 3 for figure 2 Sectional view at III-III. Figure 4 It is a schematic diagram of the structure of the first metal lead in one embodiment of the present invention. Such as Figure 2 to Figure 4 As shown, the touch lead structure of the present invention includes a first metal lead 21 , an insulating layer 23 and a second metal lead 22 stacked in sequence.
[0026] The first metal lead 21 is a strip-shaped metal structure, and a plurality of first metal leads 21 are bonded on the glass substrate 30 in parallel and at inter...
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