Suction disc device and element transfer method

Abstract

The invention provides a suction disc device and an element transfer method, and the suction disc device is used for absorbing at least one element. The suction disc device comprises an electrostaticsuction disc and patterning conductive layers, the patterning conductive layers are arranged on the electrostatic suction disc and are provided with at least one opening capable of exposing out a partof the electrostatic suction disc, when the electrostatic suction disc is powered on, the part, exposed by the at least one opening, of the electrostatic suction disc induces at least one element togenerate dipole-dipole force with the part of electrostatic suction disc, and the at least one element is made to be adsorbed to the part of electrostatic suction disc through the at least one opening. According to the suction disc device provided by the invention, the suction disc device adsorbs the element by means of the manner that the electrostatic suction disc induces the element to generatedipole-dipole force with the electrostatic suction disc, and by means of the element transfer method provided by the invention, the situation that the element is broken down by an electrostatic forceis avoided.

Description

technical field [0001] The invention relates to a chuck device and a component transfer method, in particular to a chuck device with a patterned conductive layer and a component transfer method using the same. Background technique [0002] Generally speaking, the assembly of traditional electronic parts is made by mechanical pick-place. However, as the size of components becomes smaller and smaller, the traditional method of handling will lead to a significant increase in cost. In addition, when electronic components enter micro- or nano-scale dimensions, mechanical handling methods are not conducive to use. Although someone proposes to use a novel method such as a suction nozzle to replace the mechanical picking method, it has the disadvantages of high cost and difficult manufacturing of jigs. Therefore, the assembly of tiny components is stuck in a bottleneck. Contents of the invention [0003] The invention provides a sucker device, which absorbs components by induci...

AI Technical Summary

Problems solved by technology

However, as the size of components becomes smaller and smaller, the traditional method of handling will lead to a significant increase in cost

In addition, when electronic parts enter micro- or nano-scale dimensions, mechanical handling methods are not conducive to use

Although some people propose to use novel methods such as suction nozzles to replace the mechanical picking method, but it has the disadvantages of high cost and difficult manufacturing of jigs

Therefore, the assembly of tiny components is a bottleneck

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