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A metal heat dissipation module and its preparation method

A heat dissipation module and metal technology, which is applied in the field of electronic component preparation, can solve problems such as noise, large volume, and easy precipitation of dust

Active Publication Date: 2019-09-03
扬州华盟电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, electronic plastic fans have the following disadvantages: large volume and high noise, which is not conducive to the development of electronic products in the direction of lightness and precision
[0003] The electronic plastic fan is a traditional fan with a relatively large volume. Its working principle is that the motor drives the blades to drive the air circulation to dissipate heat. There will inevitably be noise, and it is easy to deposit dust, which is difficult to clean and even malfunctions.

Method used

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  • A metal heat dissipation module and its preparation method

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Effect test

Embodiment 1

[0055] This embodiment provides a method for preparing a metal heat dissipation module, which uses an etching method to prepare a metal heat dissipation module, which includes the following steps:

[0056] (1) Pre-treatment: pre-treatment sandblasting of VC copper plate;

[0057] (2) Lamination: Carry out lamination treatment on the pre-treated VC copper plate, adopt wet lamination, the temperature of lamination treatment is 110°C, and the pressure is 4kg / cm 2 , the speed is 35Hz;

[0058] (3) Film sticking film: Use a laminating machine to carry out film sticking treatment on the film. The speed of the laminating machine is 2000mm / min, and the pressure is 4kg / cm 2 Before pasting, use film water to clean the film surface of the film;

[0059] (4) Film production: scribing film: take two pieces of film, denoted as L1 and L2, cut and tear off the film at the end of the non-directional hole along the white line on the film; paste double-sided tape: take the middle of film L1 an...

Embodiment 2

[0066] This embodiment provides a method for preparing a metal heat dissipation module, which uses an etching method to prepare a metal heat dissipation module, which includes the following steps:

[0067] (1) Pre-treatment: pre-treatment sandblasting of VC copper plate;

[0068] (2) Lamination: Carry out lamination treatment on the pre-treated VC copper plate, using wet lamination, the temperature of lamination treatment is 110±10°C, and the pressure is 3-5kg / cm 2 , the speed is 30-35Hz;

[0069] (3) Film sticking film: Use a laminating machine to carry out film sticking treatment on the film. The speed of the laminating machine is 2000mm / min, and the pressure is 3-5kg / cm 2 ; Before pasting, use film water to clean the film surface of the film;

[0070] (4) Film production: scribing film: take two pieces of film, denoted as L1 and L2, cut and tear off the film at the end of the non-directional hole along the white line on the film; paste double-sided tape: take the middle o...

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Abstract

The invention provides a metal heat-dissipation module and a preparation method thereof. The preparation method adopts an etching method to prepare the metal heat-dissipation module and comprises thefollowing steps that a VC copper plate is subjected to sand blasting pretreatment; the pretreated VC copper plate is subjected to multi-time film pressing treatment; films are subjected to film pasting treatment; the two films are bound into a hinge-type film according to the needs; the VC copper plate subjected to film pressing is subjected to hinge-type alignment; adhesive tape fixing alignmentis conducted according to a route graphic target exposed by hinge-type alignment; the films are exposed and developed multiple times, wherein defect points and impurity points of exposure of the former time are covered with a graph of exposure of the next time; the developed VC copper plate is etched; the etched VC copper plate is subjected to film retracting treatment; and the VC copper plate subjected to film retracting is subjected to sand blasting aftertreatment, and the metal heat-dissipation module is obtained. Through the preparation method, the half etching face of the prepared heat-dissipation module can be flat, and the product structure is ultrathin and stable.

Description

technical field [0001] The invention relates to a metal heat dissipation module and a preparation method thereof, belonging to the technical field of electronic component preparation. Background technique [0002] At present, notebook computers, tablets and other products on the market all use electronic plastic fans to remove the heat generated by electronic components when they are working, so as to ensure the normal operation of the components. However, the electronic plastic fan has the following disadvantages: large volume and high noise, which is not conducive to the development of electronic products in the direction of thinness and precision. [0003] The electronic plastic fan is a traditional fan with a relatively large volume. Its working principle is that the motor drives the blades to drive air circulation to dissipate heat. It will inevitably produce noise, and it is easy to deposit dust, which is difficult to clean and even malfunctions. Contents of the inve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P15/26C23F1/02C23F1/18
Inventor 王军
Owner 扬州华盟电子有限公司
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