Upper tray device for fluid polishing machine

Abstract

The invention discloses an upper tray device for a fluid polishing machine. The upper tray device comprises an upper tray cross beam, a revolution mechanism, a carrying tray swing mechanism and a carrying tray autorotation mechanism. The revolution mechanism, the carrying tray swing mechanism and the carrying tray autorotation mechanism are mounted on the upper tray cross beam. The revolution mechanism comprises an upper tray revolution spindle, an upper tray revolution driving motor, a revolution drive belt pulley, an upper tray revolution driving belt pulley and an upper tray. The carrying tray swing mechanism comprises a swing assembly, a swing motor output gear, a swing driving motor, a swing input gear, a swing spindle, a swing output gear and a swing driven gear. The carrying tray autorotation mechanism comprises carrying trays, autorotation output shafts, couplings, autorotation input shafts, autorotation driven gears, autorotation driving gears and autorotation motors. By adoption of the upper tray device for the fluid polishing machine, workpieces can be clamped in place at a time, each surface can make good contact with a polishing medium so that the uniform relative speed can be obtained, the uniform removing amount of each machining surface can be guaranteed with the liquidity characteristic of the fluid medium, and the polishing efficiency of the workpieces is high.

Description

technical field [0001] The invention relates to a top plate device of a fluid polishing machine. Background technique [0002] As a kind of polishing equipment, the fluid polishing machine is widely used in the special-shaped surface polishing of 2.5D, 3D glass, sapphire and other hard and brittle materials. [0003] Traditional polishing machines face multiple clamping when polishing 2.5D and 3D materials. Different materials need to choose different models and uneven polishing. The product is difficult to meet the expected value, and the polishing process is complex and the yield rate is low, resulting in high processing costs. . Contents of the invention [0004] The technical problem to be solved by the present invention is to realize that the workpiece is clamped in place at one time, through the non-stop swing of the carrier plate, to achieve good contact between each surface and the polishing medium to obtain a uniform relative speed, and to use the fluidity charac...

AI Technical Summary

Problems solved by technology

[0003] Traditional polishing machines face multiple clamping when polishing 2.5D and 3D materials. Different materials need to choose different models and uneven polishing. The product is difficult to meet the expected value, and the polishing process is complex and the yield rate is low, resulting in high processing costs.

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