Housing structure for totally enclosed blade server

Abstract

The present invention provides a housing structure for a totally enclosed blade server. The housing structure comprises a shell which comprises a front end part, a back end part and opposite side walls connected between the front end part and the back end part, an air outlet value and a liquid inlet valve which are arranged at the back end part, a pressure regulating valve arranged on the back endpart, and a liquid level sensor module which is arranged in the shell and is electrically connected to the pressure regulating valve to drive the pressure regulating valve to be opened or closed. Theinvention aims to provide the housing structure for the totally enclosed blade server, the overflow of cold liquid and the deformation of the shell are prevented while the liquid-cooled full-immersion heat dissipation of the fully-enclosed blade server is achieved.

Description

technical field [0001] The present invention relates to the field of data processing equipment, and more specifically, relates to a fully enclosed blade service enclosure structure. Background technique [0002] If the heat in the electronic equipment cannot be dissipated in time, the performance of the electronic equipment will degrade or even fail. The heat dissipation methods in the prior art are mostly air-cooled heat dissipation or cold liquid circulation heat dissipation. The heat transfer coefficient of the gas medium for air-cooled heat dissipation is smaller than that of the liquid medium. In the cold liquid circulation heat dissipation, the cold liquid does not undergo a phase change, and the heat dissipation is not obvious enough. Contents of the invention [0003] Aiming at the problems existing in the related art, the object of the present invention is to provide a casing structure of a fully enclosed blade server, so as to at least realize the liquid-cooled f...

AI Technical Summary

Problems solved by technology

[0002] If the heat in electronic equipment cannot be dissipated in time, the performance of electronic equipment will decrease or even fail.

The heat dissipation methods in the prior art are mostly air-cooled heat dissipation or cold liquid circulation heat dissipation. The heat transfer coefficient of the gas medium for air-cooled heat dissipation is smaller than that of the liquid medium, while in the cold liquid circulation heat dissipation, the phase change of the cold liquid does not occur, and the heat dissipation is not obvious enough.

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