Film forming device

Abstract

PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of changing the area of a shielding plate in a top plan view continuously so that it is suppressed from a large size.SOLUTION: In order to achieve the aforementioned object, a film deposition apparatus according to one mode of the invention comprises a vacuum tank, a film deposition source, a support holder and a first shielding mechanism. The film deposition source is disposed in the vacuum tank. The support holder is disposed in the vacuum tank. The support holder is disposed opposite to the film deposition source, and can support a workpiece. The support holder can rotate on a first axis. The first shielding mechanism can rotate on a second axis intersecting the first axis, between the film deposition source and the support holder. The first shielding mechanism includes a first shielding plate having a first area at a first rotational position and a second area different from the first area, at a second rotational position, as viewed from the direction of the first axis.SELECTED DRAWING: Figure 1

Description

technical field [0001] The present invention relates to a film forming device. Background technique [0002] Among the film forming apparatuses, there is a film forming apparatus that supports a plurality of substrates on a substrate holder and performs film formation while rotating the substrate holder in order to suppress variation in film thickness between substrates in the rotation direction of the substrate holder. In addition, in such a film forming apparatus, there is a film forming apparatus in which a plurality of vapor deposition sources are opposed to a substrate frame, different materials are accommodated in accordance with the plurality of vapor deposition sources, and one of the plurality of vapor deposition sources is selected The material is evaporated towards the support to form a film. [0003] However, the film thickness in the diameter direction of the substrate holder follows the so-called cosine law, and may vary depending on the distance between the d...

AI Technical Summary

Problems solved by technology

Therefore, even if the same shielding plate is provided between the vapor deposition source and the substrate rack, the variation in the film thickness in the diameter direction of the substrate rack cannot be improved.

Images