A kind of plate structure and its bonding method and electronic equipment

Abstract

The invention discloses a plate structure, a laminating method thereof and electronic equipment. The laminating method comprises the following steps: laminating a first base plate and a second base plate opposite to each other by an adhesive film; putting into a curing oven, raising the temperature to a first preset temperature to melt the adhesive film, applying a first preset air pressure, and maintaining the temperature and the pressure for first preset time; raising the temperature again to reach a second preset temperature so as to cure the adhesive film, applying a second preset air pressure, and maintaining the temperature and the pressure for second preset time; and cooling. According to the laminating method, due to the technical scheme provided in the invention, bubbles in the adhesive film are effectively discharged by virtue of two times of bubble elimination treatment, the quality of the plate structure is further improved, and high quality of the electronic equipment is ensured.

Description

technical field [0001] The invention relates to the technical field of substrate bonding, and more specifically, relates to a board structure, a bonding method thereof, and electronic equipment. Background technique [0002] At present, the bonding between the cover plate and the functional module of electronic products on the market is generally carried out by using water glue or solid glue. Since the size and thickness of the solid-state adhesive are easy to control and the laminated product has a more beautiful appearance, the current electronic products often choose the solid-state adhesive film to bond the cover plate and the functional module. However, with the structure of the laminated product and the concept of zero air bubbles after lamination, the probability of bubbles occurring in the curing process of the traditional solid adhesive is relatively high, which can no longer meet the needs of product preparation. In particular, if there is a certain amount of air ...

AI Technical Summary

Problems solved by technology

However, with the structure of the laminated product and the concept of zero air bubbles after lamination, the probability of bubbles in the curing process of the traditional solid adhesive is relatively high, which cannot meet the needs of product preparation.

In particular, if there is a certain amount of air bubbles between the fingerprint recognition module and the cover, it will affect the sensing accuracy

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