A Mounted Component Detection Method Based on Color Image Segmentation and Gradient Projection Positioning

Abstract

The invention discloses a mount element detection method based on color image segmentation and gradient projection positioning, and belongs to the technical field of automatic optical detection of mount elements. The mount element detection method based on color image segmentation and gradient projection positioning is characterized in that a designed image acquisition system is used to acquire color images; three-color (red, green and blue) images are converted into an HSI color model which is formed by three parameters (H (Hue), S (saturation) and I (Intensity)); as the HSI model directly uses the hue and the saturation having no relation with brightness when the HSI color model extracts the color information, the mount element detection method based on color image segmentation and gradient projection positioning is accurate and highly efficient in segmentation; one the above basis, positioning and detection of elements are carried out; positioning mainly uses the color and geometrical characteristics, and a positioning method based on gradient projection and a principal component characteristic value detection method are proposed; and the mount element detection method based oncolor image segmentation and gradient projection positioning has the advantages of high positioning accuracy and efficiency and accurate detection.

Description

Technical field [0001] The invention relates to the technical field of mounted component detection, and more specifically, to a mounted component detection method based on color image segmentation and gradient projection positioning. Background technique [0002] Electronic products are widely used in various fields of industry. Surface mount electronic components are the core components of electronic products, and their functions directly affect the performance of electronic products. At present, electronic components are mainly mounted on circuit boards of electronic products through soldering using surface mount technology. Therefore, the quality inspection of solder joints is very critical. Common types of solder joint defects include false soldering, insufficient solder, component offset, faulty parts, and tombstones. Traditionally, the quality of solder joints is inspected by manual visual inspection. However, as the size of electronic components becomes smaller and the mu...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the positioning accuracy of the existing mounting component defect detection scheme is not high, resulting in a high false detection rate, and provides a mounting component detection method based on color image segmentation and gradient projection positioning; the present invention It is a regular detection method for extracting features of mounted electronic components in different regions. This method is not susceptible to noise interference and has good robustness for different lighting conditions.

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