A bluetooth earphone with double wearing effect
A bluetooth earphone and body technology, applied in earpiece/earphone accessories, sensor components, sensors, etc., can solve the problems of not fitting the ear, inconvenient use, easy sliding, etc., to prevent the earphone from falling off, facilitate bump contact, The effect of preventing the hanging ring from slipping
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Embodiment 1
[0030] Such as Figure 1-2 As shown, a dual-wearing Bluetooth headset includes a body 1 and a first wearing mechanism 2. The body 1 is provided with a first wearing mechanism 2 in the middle of the front surface, and a sounding port is provided on the upper part of the front surface of the body 1 3. The first wearing mechanism 2 includes a groove 21 and a through groove 22 opened on the body 1, and the groove 21 and the through groove 22 are connected, and the bottom of the inner wall of the groove 21 is fixedly connected with a return spring 23, so The top end of the return spring 23 is fixedly connected with an annular sheet 24, the top of the annular sheet 24 is fixedly connected with a suction cup 25, the inner wall of the groove 21 is provided with a sliding groove 26, and a cover plate 27 is provided on the sliding groove 26 A push rod 28 is fixedly connected to the top of the cover plate 27, a handle 29 is fixedly connected to the top of the push rod 28, and the handle 29...
Embodiment 2
[0032] Such as Figure 3-4 As shown, on the basis of embodiment 1, it further includes a second wearing mechanism 4, which includes a protrusion 41 provided on the sounding port 3 and a collar 42 that is clamped on the sounding port 3. A first squeeze block 43, a second squeeze block 44 and a third squeeze block 45 are respectively fixedly connected to the inner wall of the clamp ring 42, and a hanging ring 46 is fixedly connected to the clamp ring 42.
Embodiment 3
[0034] On the basis of the first and second embodiments, the front surface of the body 1 is provided with a long groove 5 for the push rod 28 to move.
PUM
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Abstract
Description
Claims
Application Information
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