Design method for improving the flatness of rigid-flex board
A technology of rigid-flex board and design method, applied in multilayer circuit manufacturing, printed circuit stress/deformation reduction, printed circuit components and other directions, can solve problems such as deformation of rigid-flex board, and achieve the effect of reducing waste disposal costs
Active Publication Date: 2020-06-16
江西弘信柔性电子科技有限公司
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Problems solved by technology
If the stress release of the rigid-flex board of the camera chip on the carrier board made by combining PP sheets with pure copper is not complete, the stress will be released after high temperature, causing the rigid-flex board to deform after SMT.
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[0032] In order to make the technical solution of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings. Any solution obtained by equivalent replacement and conventional reasoning of the technical features of the technical solution of the present invention falls within the protection scope of the present invention.
[0033] As shown in the figure, the design method to improve the flatness of the rigid-flex board is as follows:
[0034] The rigid-flex board includes the top layer board, the second layer board, the third layer board and the bottom layer board in sequence from top to bottom, and the residual copper ratio of the top layer board, the second layer board and the third layer board is 55~65% %, but the difference between the residual copper rate of the top layer board, the second layer board and the third layer board is not more than 3%. The difference of residual copper rate is not more than ...
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The invention provides a design method for improving flatness of a rigid-flex PCB (printed circuit board). The method comprises steps as follows: the rigid-flex PCB comprises a top layer board, a second layer board, a third layer board and a bottom layer board in sequence from top to bottom, wherein residual copper rates of circuits of the top layer board, the second layer board and the third layer board are in a range of 55%-65%, difference of the residual copper rates of the circuits of the top layer board, the second layer board and the third layer board does not exceed 3%, and difference between the residual copper rate of the bottom layer circuit and the residual copper rate of the circuit of the top layer board, the second layer board or the third layer board does not exceed 15%; stress is sufficiently released in the production process of the rigid-flex PCB, and the deformed rigid-flex PCB is leveled in a hot-pressing leveling manner.
Description
technical field [0001] The invention relates to a method, in particular to a design method for improving the flatness of a rigid-flex board. Background technique [0002] As the pixels of mobile phone cameras are getting higher and higher, the focus requirements of the camera lens are getting higher and higher. If the focus is not good, the image taken will appear blurred or ghosting. The focus is mainly determined by the flatness of the rigid-flex board that carries the lens chip. If the flatness of the carrier board is not enough, the lens support frame will be tilted, and eventually the center of the chip and the center of the lens will not be on the same vertical line, resulting in blurred or blurred images. ghosting. In order to solve this problem, a breakthrough must be made in the flatness of the rigid-flex board carrying the camera chip. If the stress release of the rigid-flex board of the camera chip on the carrier board made by combining PP sheets with pure coppe...
Claims
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IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0271H05K3/4691H05K2203/1105H05K2203/1121
Inventor 李胜伦程振平
Owner 江西弘信柔性电子科技有限公司