LED package method

Abstract

The invention relates to an LED package method. The LED package method comprises the steps of preparing a cooling substrate (21); preparing an LED chip, fixedly connecting the LED chip onto the cooling substrate (21); forming a first silica gel layer (22) on an upper surface of the LED chip; forming a semi-spherical lens layer (23) on an upper surface of the first silica gel layer (22), wherein the semi-spherical lens layer (23) comprises a plurality of semi-spherical lenses; forming a second silica gel layer (24) above the semi-spherical lens layer (23) and the first silica gel layer (22), wherein the second silica gel layer (24) contains fluorescent powder; and baking an LED package structure comprising the first silica gel layer (22), the semi-spherical lens layer (24) and the second silica gel layer (24) for a long time so as to complete package of an LED. According to the LED package method disclosed by the embodiment of the invention, the semi-spherical lens layer is arranged between the first silica gel layer and the second silica gel layer, the fluorescent powder is arranged in the second silica gel layer, so that light beams are more concentrated and uniformly irradiate, moreover, the fluorescent powder is prevented from being in direct contact with the LED chip, and the light extraction efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of photoelectric devices, and in particular relates to an LED packaging method. Background technique [0002] Light Emitting Diode (LED) is a solid-state semiconductor device that can convert electrical energy into visible light. It is widely used in display screens, traffic signals, display light sources, automotive lights, LED backlights, and lighting sources. . [0003] However, in practical application, those skilled in the art find that the prior art has at least the following technical problems: [0004] 1. Since the light emitted by the LED light source is generally distributed in a divergent manner, the light is not concentrated, and the secondary shaping through the external lens increases the production cost; [0005] 2. Phosphor powder is generally directly coated on the surface of the chip. The high temperature generated by the LED chip reduces the quantum efficiency of the phosphor powder. In ...

AI Technical Summary

Problems solved by technology

[0004] 1. Since the light emitted by the LED light source is generally distributed in a divergent manner, the light is not concentrated, and the secondary shaping through the external lens increases the production cost;

[0005] 2. Phosphor powder is generally directly coated on the surface of the chip. The high temperature generated by the LED chip reduces the quantum efficiency of the phosphor powder. In addition, the chip absorbs the light reflected back by the phosphor powder, which reduces the light extraction of the packaging structure. efficiency;

[0006] 3. Due to the blocking effect of the packaging structure on light, the light cannot be fully irradiated from the packaging structure, and the light transmittance is low

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