LED packaging structure

Abstract

The invention relates to an LED packaging structure. The structure comprises an LED base plate (11), a first silica gel layer (12), a hemispherical lens area (13) and a second silica gel layer (14), wherein the first silica gel layer (12) is arranged on the LED base plate (11); the hemispherical lens area (13) is arranged on the first silica gel layer (12); and the second silica gel layer (14) isarranged on the upper layer of the first silica gel layer (12) and the lens area (13). According to the LED packaging structure provided by the invention, the structure comprising the first silica gellayer, the hemispherical lens area and the second silica gel layer is adopted; by using the characteristic that different types of silica gels and fluorescent powder gels are different in refractiveindexes in the structure comprising the first silica gel layer, the hemispherical lens area and the second silica gel layer, a lens is formed in silica gel, and the light-emitting and dispersing problems of an LED chip are improved, so that light emitted by a light source can be more concentrated; simultaneously, the refractive indexes of the first silica gel layer, the hemispherical lens area andthe second silica gel layer are increased in sequence; and more light of the LED chip can be irradiated through the packaging material.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, in particular to an LED packaging structure. Background technique [0002] At the end of the last century, the breakthrough of III-V compound semiconductors represented by GaN-based materials in the field of blue light chips brought about a revolution in lighting. The symbol of this revolution is the high-power light-emitting diode (Light-Emitting Diode, LED) Semiconductor lighting technology (Solid State Lighting, SSL) as the light source. [0003] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. This is a great le...

AI Technical Summary

Problems solved by technology

[0005] 1. At present, most of the chips are packaged on a thin metal heat dissipation substrate. Because the metal heat dissipation substrate is thin, the heat capacity is small, and it is easy to deform, the contact between it and the bottom surface of the heat sink is not close enough to affect the heat dissipation effect.

[0006] 2. Since the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightness of the light source to be insufficiently concentrated, and generally requires secondary shaping through an external lens to meet the lighting needs of specific occasions, which increases production costs.

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