A method of using a pressing mechanism of a circuit board with a clamping device
A technology of clamping device and pressing mechanism, which is applied in printed circuit, multilayer circuit manufacturing, printed circuit manufacturing, etc. It can solve problems such as difficult control of the alignment of the pressing layer, influence on the quality of the circuit board, and unstable pressing. , to achieve the effects of low production cost, improved pressing process quality, and enhanced cutting effect
Active Publication Date: 2020-03-31
SHANGHAI NCATEST TECH CO LTD
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Problems solved by technology
In the lamination process of the current technology, the structure as a whole is quite complicated, and the lamination is often unstable, and the alignment between the lamination layers is also difficult to control, which will have a direct impact on the quality of the circuit board
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[0014] The present invention will be further described below in conjunction with specific examples.
[0015] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.
[0016] The application principle of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. as attached figure 1 to attach figure 2 As shown, the operation platform box 1 is included, the operation platform box 1 is provided with electrical control components, the operation platform box 1 is provided with a clamping platform 2, and the clamping platform 2 is provided with a clamping body 2-1. A support frame 3 is also provided o...
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The invention discloses a method of using a circuit board lamination mechanism with a clamping device, which comprises an operation platform box boy, an electrical control assembly, a heating and pressing generation device, a clamping platform and a clamping body. Through high-temperature and high-pressure operation control, the lamination process can be accurately controlled, the quality of the lamination process is greatly improved, expansion and contraction stability of the multilayer board after high-temperature and high-pressure lamination is ensured, interlayer dislocation of the multilayer board can be effectively prevented, and besides, the mechanism is also provided with the clamping platform and the clamping body, the board position can be effectively controlled, the overall deflection can be prevented, scrap of the circuit board is avoided, the making cost is low, the cutting effects are enhanced obviously, and the overall efficiency and the operation reliability are greatlyimproved.
Description
technical field [0001] The invention relates to the field of pressing of circuit boards, more specifically, to a pressing mechanism of a circuit board with a clamping device and a use method thereof. Background technique [0002] The circuit board is a carrier for carrying integrated circuits and plays a very important role. Circuit boards are generally divided into single-layer boards and multi-layer boards. At present, multi-layer circuit boards are more widely used. The lamination process is an indispensable process in the production process of multi-layer circuit boards. It affects the performance of circuit boards. Quality has a direct impact. In the lamination process of the current technology, the structure as a whole is quite complicated, and the lamination is often unstable, and the alignment between the lamination layers is also difficult to control, which will have a direct impact on the quality of the circuit board. Therefore, in view of this current situation,...
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IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/068
Inventor 胡忠臣
Owner SHANGHAI NCATEST TECH CO LTD