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Apparatus and method for measuring horizontal direction of photolithography machine

A measuring device and horizontal technology, applied in the field of lithography machines, can solve problems such as poor CDU performance and poor overlay imaging accuracy

Active Publication Date: 2020-05-01
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a device and method for measuring the horizontal direction of a lithography machine to solve the problems of poor overlay imaging accuracy and poor CDU performance caused by deformation and thermal deformation of the lithography machine frame in the prior art

Method used

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  • Apparatus and method for measuring horizontal direction of photolithography machine
  • Apparatus and method for measuring horizontal direction of photolithography machine
  • Apparatus and method for measuring horizontal direction of photolithography machine

Examples

Experimental program
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Embodiment 1

[0031] Such as Figure 1-2 As shown, the present invention provides a horizontal measuring device for a lithography machine, including a complete machine frame (not shown in the figure), a projection objective lens unit 1 arranged on the complete machine frame, an objective lens inclination measurement unit and an objective lens inclination angle Compensation unit, the objective lens inclination angle measurement unit includes a first position measurement unit corresponding to the position above the lens barrel of the projection objective lens unit 1, a second position measurement unit corresponding to the position below the lens barrel of the projection objective lens unit 1, and a second position measurement unit located at the position of the lens barrel of the projection objective lens unit 1 The main bracket 5 on one side of the projection objective lens unit 1 is described above. In this embodiment, the main bracket 5 is disposed on the main substrate 8 . The position o...

Embodiment 2

[0047] The difference from Embodiment 1 is that in this implementation, the frame of the whole machine is made of steel, and the projection objective lens unit 1 is made of a ceramic material frame to improve the deformation resistance of the main substrate 8. The first The position measurement unit includes a mask table interferometer support 31 provided on the main support 5, a mask table measuring interferometer 32 provided on the mask table interferometer support 31, and a mask provided on the mask table 7 Table strip mirror 71 and cube mirror 72, such as Image 6 shown. Preferably, the second position measurement unit includes a workpiece stage interferometer support 41 fixed on the main support 5, a workpiece stage measurement interferometer 42 arranged on the workpiece stage interferometer support 41, and a workpiece stage interferometer 42 arranged on the workpiece stage 6. On the work table strip mirror 61, such as Figure 7 shown. Since the projection objective le...

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Abstract

The invention discloses a photolithography machine horizontal direction measurement device and method and method. The device includes a complete machine frame, a projection objective lens unit disposed on the whole machine frame, an objective lens inclination angle measurement unit and an objective lens inclination angle compensation unit, and the objective lens inclination angle measurement unitincludes a first position measurement unit corresponding to the upper orientation of a projection objective lens unit lens barrel, a second position measurement unit corresponding to the lower orientation of the projection objective lens unit lens barrel, and a main bracket on the side of the projection objective lens unit. The tilt angle of the projection objective lens unit relative to the mainbracket is measured by the first position measurement unit corresponding to the upper orientation of the projection objective lens unit lens barrel and the second position measurement unit corresponding to the lower orientation of the projection objective lens unit lens barrel, an objective lens tilt angle compensation unit calculates offset between a workpiece table and a mask table according tothe tilt angle, and moves the workpiece table and the mask table to compensate, and the problems of alignment precision reduction and poor CDU performance caused by lithography machine frame deformation and thermal deformation affect can be solved.

Description

technical field [0001] The invention relates to the technical field of lithography machines, in particular to a device and method for measuring the horizontal direction of a lithography machine. Background technique [0002] In today's information society, people's requirements for liquid crystal displays are getting higher and higher. At present, OLED (Organic Light-Emitting Diode, organic light-emitting display) has the advantages of ultra-thin, active light emission, high brightness, high contrast, high vision, wide working range, low power consumption, and low cost, and is widely used by people. Manufacturing OLED products requires TFT (Thin Film Transistor, thin film transistor) lithography equipment. [0003] As people's demand for the size of liquid crystal displays is increasing, the TFT photolithography equipment required to produce OLEDs is also increasing; the size of the workpiece table carrying the glass substrate is also increasing, and the movement quality of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G01B11/16
CPCG01B11/161G03F7/7085
Inventor 杨玉杰
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD