Automatic adjustment device and method for levelness of plasma etching machine

Abstract

The invention relates to an automatic adjustment device for the levelness of a plasma etching machine, which comprises an inclination angle sensor, a plurality of adjustment assemblies and a controller, wherein the inclination angle sensor is fixedly installed on the plasma etching machine in a mode of being parallel to an electrostatic sucker of a bearing substrate in the plasma etching machine and is used for detecting the inclination angle and inclination direction of the plasma etching machine; the plurality of adjustment assemblies are respectively connected below the bottom of the plasmaetching machine; and the controller is connected with the inclination angle sensor and each adjustment assembly, and controls each adjustment assembly to correspondingly perform a rising or falling operation according to the received inclination angle and inclination direction of the plasma etching machine so as to enable the plasma etching machine to stay at a level state. The automatic adjustment device monitors the levelness of the plasma etching machine in real time through the inclination angle sensor, automatically accomplishes levelness adjustment with the accuracy being higher than 0.1 degree under the condition of not opening a cavity of the etching machine and ensures the uniformity of substrate etching.

Description

technical field [0001] The invention relates to a device and method for adjusting the levelness of a plasma etching machine, in particular to a device and method for automatically adjusting the levelness of a plasma etching machine by using an inclination sensor, and belongs to the technical field of plasma etching machines. Background technique [0002] Plasma etching machine, by introducing a reaction gas containing an appropriate etchant or deposition source gas into the chamber of the vacuum etching machine, and then applying radio frequency energy to the chamber of the etching machine to dissociate the reaction gas to generate plasma, It is used to process the surface of the substrate placed in the cavity of the etching machine. [0003] The plasma etching machine commonly used in the prior art includes an etching machine cavity, which is composed of a top cover at the top, a bottom wall at the bottom, and a side wall connected between the top cover and the bottom wall,...

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Problems solved by technology

[0007] However, this method of manually adjusting the level of the etching machine mainly has the following two problems: First, due to the limited accuracy of human naked eye observation, the method of using a bubble level to adjust the level can only reach a maximum of 0.1 degrees The precision, that is to say, after the leveling adjustment is completed, the etching machine will still have an inclination angle of at least 0.1 degrees, and the inclination angle of this order will still affect the uniformity of subsequent etching of the substrate

Second, usually only when the machine is installed for the first time, the cavity of the etching machine is opened to adjust the levelness, and in the subsequent work of the etching machine, due to the influence of factors such as thermal expansion and contraction, vibration, etc. The level of the etching machine will still change but cannot be known, and cannot be further adjusted, resulting in gradual drift in the uniformity of etching and a gradual decline in accuracy

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