Package structure and flexible display device with the same

A packaging structure and packaging layer technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of poor bending resistance and mechanical properties

Active Publication Date: 2018-05-18
YUNGU GUAN TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a packaging structure and a flexible display device including the packaging structure, so as to solve the problem of poor bending resistance of the packaging structure of the existing flexible display device

Method used

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  • Package structure and flexible display device with the same
  • Package structure and flexible display device with the same
  • Package structure and flexible display device with the same

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] The existing packaging structure is mainly an inorganic layer-organic layer-inorganic layer packaging structure formed by sequentially stacking an inorganic layer, an organic layer and an inorganic layer. Among them, the inorganic layer is used to block the influence of water and oxygen on structures such as the light-emitting layer of the flexible substrate, and the organic layer is used to reduce the stress of the inorganic layer.

[002...

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Abstract

The embodiment of the invention provides a package structure and a flexible display device with the same. The package structure comprises a bending area and a non-bending area, and modulus of elasticity of the bending area is lower than the modulus of elasticity of the non-bending area. According to the package structure and the flexible display device with the same, by means of setting the bending area of the package structure as a low elastic modulus material, the purpose that bending performance of the package structure is effectively improved while the package effect of the package structure is guaranteed is achieved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a package structure and a flexible display device including the package structure. Background technique [0002] With the continuous development of electronic display technology, users have higher and higher requirements for electronic device display screens, and flexible screens, one of the important development directions of electronic device display screens, have gradually received more and more attention. Flexible screens have the characteristics of bendability and strong flexibility, and have multiple advantages such as light and thin volume, low power consumption, easy portability, strong plasticity, and gorgeous colors. [0003] However, the TFE (thin film packaging technology) packaging structure of the existing flexible screen has poor bending resistance mechanical properties, and the TFE packaging structure with poor bending resistance mechanical properties will have a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/844H10K2102/311
Inventor 马维民于锋刘晓佳李阳马应海杨海涛
Owner YUNGU GUAN TECH CO LTD
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