Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Direct-current direct-drive type driving chip with multiple packaging forms and packaging device and method

A technology for driving chips and packaging devices, which is applied to circuits, electrical components, electric solid devices, etc., can solve problems such as inaccurate positioning, and achieve the effect of high-efficiency chip packaging

Pending Publication Date: 2021-11-30
深圳市谦诚半导体技术有限公司
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a multi-packaging DC direct-drive driver chip and packaging method, which has the advantages of high intelligence and solves a series of problems such as inaccurate positioning in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Direct-current direct-drive type driving chip with multiple packaging forms and packaging device and method
  • Direct-current direct-drive type driving chip with multiple packaging forms and packaging device and method
  • Direct-current direct-drive type driving chip with multiple packaging forms and packaging device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0053] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes a multi-packaging direct-current drive chip and a packaging method thereof.

[0054] In a typical implementation of the present application, such as Figure 1-10 As shown, a multi-packaging DC direct-drive driver chip includes a chip body, and a marking groove for marking fluorescent substa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of chip packaging, and discloses a direct-current direct-drive type driving chip with multiple packaging forms and a packaging device and method. Stable and ordered blanking is completed through a simple mechanical structure by arranging an electric telescopic rod and the like, rapid heat fusion packaging is achieved by adopting a fluorescence labeling mode in cooperation with a hot melting gun, different chip packaging shells can be selected in a self-adaptive manner while precise packaging is realized, and the packaging efficiency is improved. Two clamping blocks at the corresponding positions are driven to rotate with the corresponding rotating shafts as the axes through the arrangement of clamping air cylinders and the like, then the clamping blocks on the two sides clamp the two sides of a to-be-packaged chip, the packaging stability is further improved, the displacement influence on the to-be-packaged chip caused by the operation of a conveying belt is avoided, a pushing plate pushes the corresponding to-be-packaged chip into a defective product groove through the operation of a material returning air cylinder, defective product collection is completed, and the packaging effect of an assembly line is ensured.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a direct-current direct drive driver chip in a multi-package form, as well as a packaging device and method. Background technique [0002] Chip packaging is the shell for installing semiconductor integrated circuit chips, which has the functions of placing, fixing, sealing, protecting chips and enhancing electrothermal performance. Chip packaging is a bridge between the internal world of the chip and the external circuit. The contacts of the chip are connected to the pins of the package shell with wires, and the pins are connected to other devices through the wires on the printed board; the package is integrated with the CPU and other LSIs. The circuit all plays an important role, the number of pins increases, the pin spacing is reduced, the weight is reduced, the reliability is improved, and it is more convenient to use. [0003] In the prior art, the common LED driver c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/544H01L21/67H01L21/50H01L21/56
Inventor 宋志华
Owner 深圳市谦诚半导体技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com