The application discloses a
chip packaging device and a
chip stack packaging method thereof, and is applied to the technical field of
chip packaging, and comprises a rack, a feeding mechanism, a packaging mechanism, a
transfer mechanism, a cooling mechanism, a discharging mechanism and a control instrument, the feeding mechanism, the packaging mechanism, the
transfer mechanism, the cooling mechanism and the discharging mechanism are sequentially arranged on the rack in a counterclockwise manner, and the control instrument is installed on the top of the rack through a universal arm; the packaging mechanism comprises a supporting frame, a clamping seat, a driving
assembly, a plurality of injection molding boxes, a plurality of injection molding heads and a heat preservation
assembly, the driving
assembly is arranged on the top of the supporting frame, the driving assembly comprises a supporting seat two, a cylinder one and a base, the injection molding box comprises a
temporary storage box, two groups of
discharge ports one, two groups of feeding ports, two groups of circulating material ports one, a plurality of telescopic rods and two groups of push plates, and the application can improve the forming quality and reliability of the stack chip packaging which is sensitive to thermal stress.