Display panel preparation method, display panel and display device

A technology for display panels and display areas, which is used in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices. The effect of improving the display

Active Publication Date: 2020-05-12
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, simple screen punching still has many difficulties for panel manufacturers, which makes it difficult to improve the yield rate in actual production
At the same time, the array film layer will be damaged during the physical drilling process

Method used

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  • Display panel preparation method, display panel and display device
  • Display panel preparation method, display panel and display device
  • Display panel preparation method, display panel and display device

Examples

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Effect test

Embodiment

[0040] The present invention provides a display device, wherein the display device can be a television, a mobile phone, a tablet, a computer, a camera, etc.; the display device includes a display panel 1 . The display panel 1 of this embodiment includes a substrate 2, an array structure layer 3, an organic light-emitting layer 4, and an encapsulation structure 5 that are sequentially stacked. figure 2 As shown, the display panel 1 includes a display area 11, a spacer area 12 and a non-display area 13, the spacer area 12 separates the display area 11 and the non-display area 13, and the spacer area 12 is provided with several Partition grooves 6 arranged at intervals.

[0041] Wherein the non-display area 13 in this embodiment is an open area, and an opening is provided therein, and the opening is used for placing a camera, a sensor and / or an earpiece. The opening in this embodiment is a round hole, so the partition groove 6 is a plurality of concentric circles with different...

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Abstract

The invention provides a display panel preparation method, a display panel and a display device. According to the preparation method, before an array film layer is prepared, a concave part is formed on a substrate corresponding to the frame region of a punching region, so that adverse effects on the array film layer when a concave part is formed on the substrate after an array process are avoided;the concave part of a non-display area is filled with an easily-removed material; after preparation of the array film layer by an array process is completed, part of a barrier layer right above the concave part is removed, the remaining unremoved barrier layer right above the concave part covers the edge of the opening of the concave part, and then the easily-removed material in the concave partis removed; and an organic light-emitting layer is disconnected at the concave part in the subsequent forming process of the organic light-emitting layer, so that the organic light-emitting common layer in the punching area can be effectively removed or disconnected when a display area is punched so as to avoid water and oxygen from entering the organic light-emitting film layer in the display area along the inner side wall of the concave part.

Description

technical field [0001] The invention belongs to the technical field of display devices, and in particular relates to a method for preparing a display panel, a display panel and a display device. Background technique [0002] At present, flexible OLED displays are used more and more in intelligent terminal products such as mobile phones and tablets. In the era of full screens, major mobile phone manufacturers have different pursuit methods for full screens. Among them, Samsung S10 led by punching holes Screens have become the mainstream at present, and mobile phone components such as cameras are placed under the screen punching holes to increase the screen-to-body ratio of the display panel. [0003] However, simple screen punching still has many difficulties for panel manufacturers, which makes it difficult to improve the yield rate in actual production. At the same time, the array film layer will be damaged during the physical drilling process. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K59/12H10K50/844H10K59/1201H10K71/00
Inventor 米磊
Owner YUNGU GUAN TECH CO LTD
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