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Display panel preparation method, display panel and display device

A display panel, directly above technology, applied in the field of display devices, can solve problems such as damage to the array film layer and difficulties in yield improvement, and achieve the effects of ensuring packaging effects, improving packaging effects, and improving display effects

Inactive Publication Date: 2019-11-15
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, simple screen punching still has many difficulties for panel manufacturers, which makes it difficult to improve the yield rate in actual production
At the same time, the array film layer will be damaged during the physical drilling process

Method used

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  • Display panel preparation method, display panel and display device
  • Display panel preparation method, display panel and display device
  • Display panel preparation method, display panel and display device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0042] Such as figure 1 As shown, the preparation method of the display panel provided by the present invention includes the following steps:

[0043] A substrate is provided, wherein the substrate comprises a first flexible layer 1, a first barrier layer 2 and a second flexible layer 3;

[0044] A recessed portion 12 is formed on the substrate corresponding to the frame area of ​​the perforated area of ​​the display panel, and the recessed portion 12 is filled with easy-to-remove materials; specifically, the perforated area of ​​the display panel can be correspondingly provided with a camera, an earpiece, or a physical button, etc. External components; along the direction of increasing radius in the frame area, the recesses are arranged at intervals, the number can be selected according to needs, for example, it can be 1, 4 or 10, and the shape can be circular, elliptical or other; The depressions 12 formed on the circles surrounded by different radii jointly form a ring alo...

Embodiment 1

[0068] This embodiment provides a method for preparing a display panel, such as figure 1 and 3 shown, including the following steps:

[0069] S1. Provide a base, the base includes a first flexible layer 1, a first barrier layer 2 and a second flexible layer 3 which are sequentially stacked, the first flexible layer 1 and the second flexible layer 3 are both polyimide layers, the first The thickness of the flexible layer 1 is 10 μm, the thickness of the second flexible layer 3 is 10 μm; the first barrier layer 2 is an inorganic layer, the inorganic layer is a silicon nitride (SiNx) layer, and the thickness of the first barrier layer 2 is 1 μm;

[0070] S2. Form a depression on the substrate corresponding to the frame area of ​​the perforated area of ​​the display panel. The depression is arranged on the second flexible layer 3. The depression can specifically be an annular depression. The annular depression has an annular depression groove. The part is formed by means of expo...

Embodiment 2

[0081] This embodiment provides a method for preparing a display panel, such as figure 1 and 3 shown, including the following steps:

[0082] S1. Provide a base, the base includes a first flexible layer 1, a first barrier layer 2, and a second flexible layer 3 that are stacked in sequence, and both the first flexible layer 1 and the second flexible layer 3 are polyimide layers. The difference in the thickness of each film layer of the substrate in Example 1 is that the thickness of the first flexible layer 1 is 8 μm, and the thickness of the second flexible layer 3 is 12 μm; the first barrier layer 2 is an inorganic layer, and the inorganic layer is silicon nitride (SiNx ) layer, the thickness of the first barrier layer 2 is 0.8 μm;

[0083] S2. Form a depression on the substrate corresponding to the frame area of ​​the perforated area of ​​the display panel. The depression is arranged on the second flexible layer 3. The depression can specifically be an annular depression. ...

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Abstract

The invention provides a display panel preparation method, a display panel and a display device. The method is characterized in that before an array film layer is prepared, a depression portion is formed on a substrate corresponding to a border area of a punching area, adverse effects on the array film during formation of the depression portion on the substrate after the array process is avoided,moreover, a depression portion of a non-display area is filled with an easily removable material, after the array film is prepared by the array process, a part of a second barrier layer directly abovethe depression portion is removed, the remaining unremoved second barrier layer directly above the depression portion is made to cover an opening edge of the depression portion, then, the easily removable material in the depression portion is removed, during subsequent formation of an organic light emitting layer, the organic light emitting layer is disconnected at the depression portion, when the display area is punched, the organic light emitting common layer can be effectively removed or disconnected in the punching area, and thereby the water and the oxygen are prevented from entering theorganic light emitting film layer of the display area along an inner side wall of the depression portion.

Description

technical field [0001] The invention belongs to the technical field of display devices, and in particular relates to a method for preparing a display panel, a display panel and a display device. Background technique [0002] At present, flexible OLED displays are used more and more in intelligent terminal products such as mobile phones and tablets. In the era of full screens, major mobile phone manufacturers have different pursuit methods for full screens. Among them, Samsung S10 led by punching holes Screens have become the mainstream at present, and mobile phone components such as cameras are placed under the screen punching holes to increase the screen-to-body ratio of the display panel. [0003] However, simple screen punching still has many difficulties for panel manufacturers, which makes it difficult to improve the yield rate in actual production. At the same time, the array film layer will be damaged during the physical drilling process. Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K59/12H10K50/844H10K59/1201H10K71/00
Inventor 米磊
Owner YUNGU GUAN TECH CO LTD
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