Support assembly, chip assembly therewith, camera with support assembly, and electronic equipment with support assembly

A camera and component technology, applied in the electronic field, can solve problems such as cracking and breakage, and achieve the effect of high strength, easy installation, and improvement of delamination and shedding.

Active Publication Date: 2018-06-01
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, due to its structural characteristics, the light-transmitting sheet in the camera is easily damaged or broken under the action of external force

Method used

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  • Support assembly, chip assembly therewith, camera with support assembly, and electronic equipment with support assembly
  • Support assembly, chip assembly therewith, camera with support assembly, and electronic equipment with support assembly

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Embodiment Construction

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0024] In describing the present invention, it is to be understood that the terms "central", "transverse", "thickness", "upper", "lower", "inner", "outer", "axial", "radial" , "Circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific Orientation, ...

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PUM

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Abstract

The invention discloses a support assembly, a chip assembly therewith, a camera with the support assembly, and an electronic equipment with the support assembly. The support assembly comprises a support main body, a metal part, and a light passing piece body. The support main body is provided with a through light channel, and the metal part is connected with the support main body. The light channel passes through the metal part, and a part, close to the light channel, of the metal part stretches into the light channel to construct a support part. The light passing piece body is located in thelight channel, and a part of structure of the support main body is constructed to form the light passing piece body through etching. The light passing piece body is a resin part. According to the invention, the light passing piece body can be installed on the support main body through the metal part, and the support assembly is simple in setting mode and is high in installation stability. Moreover, the metal part is stable in structure, is high in strength, and can prevent a part of extrusion from the support main body from causing the breakage or falling of the light passing piece body, thereby improving the strength of the support assembly, and solving a problem of layered falling of the support assembly.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a bracket assembly and a chip assembly, a camera and electronic equipment with the same. Background technique [0002] With the development of related technologies of electronic equipment, electronic equipment is gradually developing towards miniaturization. The camera is an important part of the electronic equipment, and the design size of the camera is a key technical point to reduce the thickness of the electronic equipment. In addition, due to its own structural characteristics, the light-transmitting sheet in the camera is easily damaged or broken under the action of external force. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a camera bracket assembly, which has the advantages of high structural stability and small volume. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225H04M1/02
CPCH04M1/0264H04N23/50H04N23/57H04N23/56H04N23/55H04N23/54
Inventor 韦怡范宇李龙佳龚江龙
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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