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Thread processing method of PCB board

A PCB board and thread processing technology, applied in the direction of metal processing, metal processing equipment, metal processing machinery parts, etc., can solve the position deviation of the inlaid heat dissipation copper block, affect the heat dissipation effect of the PCB board, and the complicated manufacturing process of the copper paste plug hole, etc. problem, to achieve the effect of improving the cooling effect

Inactive Publication Date: 2018-06-05
SUZHOU NINGLIN PHOTOELECTRIC SCI & TECHCO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the complicated manufacturing process and high cost of copper paste plug holes, most manufacturers use plug copper blocks as the main way for PCB boards to dissipate heat.
However, there is a problem of poor alignment reliability when drilling holes, which causes the position of the inlaid heat dissipation copper block to shift, and because of the tolerance of the hole diameter in the PCB manufacturing process, the fixation between the copper block and the PCB hole is not good. During the use of the PCB board The copper block is prone to loosening or even falling off, which will affect the heat dissipation effect of the PCB board

Method used

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  • Thread processing method of PCB board

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Effect test

Embodiment 1

[0026] figure 1 It is a schematic flow chart of a method for threading a PCB board provided by an embodiment of the present invention. Such as figure 1 As shown, the thread processing method of the PCB board provided by the embodiment of the present invention includes:

[0027] Step 110, clamping and attaching the positioning reference plate to the working table of the gong machine.

[0028] Wherein, the shape and size of the positioning reference board are the same as the shape and size of the PCB board to be processed.

[0029] Optionally, the area of ​​the positioning reference plate is larger than the area of ​​the workbench. At this time, the PCB board to be processed is relatively large. When drilling holes on the edge of the PCB board to be processed (the position that does not cover the workbench), the positioning reference plate can be used to support the PCB to be processed, which is conducive to stabilizing the hole. In addition, the positioning reference plate ...

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PUM

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Abstract

The invention discloses a thread processing method of a PCB board. The method comprises the steps that a positioning reference plate is clamped and close to a workbench of a gong machine, wherein theshape and size of the positioning reference plate are the same as the shape and size of the PCB board to be processed; suction cup mechanical arms of the gong machine are adopted for adsorbing the PCBboard to be processed, and feeding and blanking mechanical arms of the gong machine are adopted to move the adsorbed PCB board to be processed to the top of the positioning reference plate; a CCD sensor of the gong machine is used for positioning the PCB board to be processed, so that the PCB board to be processed is completely aligned with the positioning reference plate; the PCB board to be processed is pressed to the positioning reference plate; the position of the PCB board to be processed where the gong machine inlays a heat-dissipating copper block is used for boring, and a through holefor fixing the heat-dissipating copper block is obtained; a screw tap of the gong machine is used for conducting tapping on the PCB board to be processed to obtain a threaded hole for fixing the heat-dissipating copper block. The method solves the problem that drilling positions are deviated, the copper block and PCB holes are not fixed firmly, and the heat dissipation effect is improved.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of mechanical processing, and in particular to a method for threading a PCB board. Background technique [0002] With the rapid development of the electronics industry, the miniaturization and modularization of electronic products has become a major trend in the current development. The degree of integration and density is getting higher and higher. , server power supply products and wireless base stations, etc., along with the miniaturization, the problem of heat dissipation has become an urgent problem to be solved. [0003] The traditional heat dissipation solution has disadvantages such as large space occupation and poor heat conduction efficiency, and cannot meet the requirements of miniaturization. At present, the use of copper paste plug holes or copper blocks instead of dense heat dissipation holes is the main way to improve the heat dissipation performance of PCB boards fo...

Claims

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Application Information

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IPC IPC(8): B23P15/00B23Q11/10B23Q7/04
CPCB23P15/00B23Q7/04B23Q11/10
Inventor 王婷周金梅
Owner SUZHOU NINGLIN PHOTOELECTRIC SCI & TECHCO