A probe card for testing semiconductor devices includes a main board member, an upper reinforcing plate, a lower reinforcing plate, an interface member, a sub board member, a needle guide member, a needle member, a side cover member, and a clamping member. The probe card achieves an interface between the circuit boards through elastic connection pins so as to cope with a connection shock with the connection terminals of a semiconductor device, thereby preventing damages on the boards, and has the component parts combined together simply by face contacts to facilitate assembly and disassembly of the component parts and thereby to provide a great economical advantage in the aspect of maintenance and repair.