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A kind of h-bridge arm double-sided heat dissipation power module

A technology of power module and double-sided heat dissipation, which is applied in the direction of output power conversion device, AC power input conversion to DC power output, circuit, etc., which can solve the problem of low integration and achieve the effect of improving the degree of generalization

Active Publication Date: 2019-11-29
CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Power semiconductor devices are widely used in rail transit, industrial frequency conversion and other fields, but standard package power semiconductor devices only have the function of switching tubes, and the integration level is not high

Method used

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  • A kind of h-bridge arm double-sided heat dissipation power module
  • A kind of h-bridge arm double-sided heat dissipation power module
  • A kind of h-bridge arm double-sided heat dissipation power module

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Embodiment Construction

[0037] The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings and examples, so as to fully understand and implement the process of how to apply technical means to solve technical problems and achieve technical effects in the present invention. It should be noted that, as long as there is no conflict, each embodiment and each feature in each embodiment of the present invention can be combined with each other, and the formed technical solutions are all within the protection scope of the present invention.

[0038] Also, in the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without the specific details or in the particular manner described.

[0039] Aiming at the problems existing in the prior...

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Abstract

The invention provides an H-bridge arm double-side heat dissipation power module, which comprises a heat dissipation device layer, a main circuit layer and a control circuit, wherein the main circuitlayer comprises an H-bridge arm power semiconductor circuit and at least two sets of lining plates, the first set of lining plates and the second set of lining plates are arranged on the first side surface and the second side surface of the heat dissipation device layer in a contact manner, and power semiconductor chips in the H-bridge arm power semiconductor circuit are arranged on the first setof lining plates and the second set of lining plates; and the control circuit comprises a first control module and a second control module, and the first control module and the second control module are distributed on two sides of the heat dissipation device layer respectively, are electrically connected with the H-bridge arm power semiconductor circuit and are used for controlling operating states of the H-bridge arm power semiconductor circuit. Compared with the existing power semiconductors, the H-bridge arm double-side heat dissipation power module integrates the control circuit inside equipment, such that a control circuit does not need to be additionally configured in operation, thereby enabling the H-bridge arm double-side heat dissipation power module to realize intelligent controlfunctions such as driving, monitoring, protecting and diagnosis, and improving the universality degree of the equipment.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to an H-bridge double-sided cooling power module. Background technique [0002] Power semiconductor devices are widely used in rail transit, industrial frequency conversion and other fields, but standard package power semiconductor devices only have the function of switching tubes, and the integration level is not high. As one of the core components of the converter, the converter module is composed of standard packaged power semiconductor devices, heat sinks, low-inductance busbars, gate drivers and structural parts, etc., due to the limitations of structural form, device layout and device functions , There are still many imperfections in terms of power density, intelligence and convenient application. Contents of the invention [0003] In order to solve the above problems, the present invention provides an H-bridge double-sided cooling power module, the power module i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H01L25/16H02M7/00
CPCH01L23/473H01L25/162H02M7/003
Inventor 金肩舸王晓元杨进锋李彦涌范伟彭凯彭银中王雄漆宇杨涛
Owner CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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