A method for improving the centrifugal capacity of the centrifuge in the mortar recovery system

Abstract

The invention provides a method for improving a centrifugal capability of a mortar recycling system centrifuge. Considering that solid precipitated on a drum wall is thicker and thicker and the influence of the effective centrifugal radius on the centrifugal force; by periodically measuring the liquid density after the centrifugation, the liquid density exceeds some data, like 1.164 g / cm<3>, thefrequency of a spiral feed push converter is reduced by a small margin, thus the rotation speed of a spiral fed push blades is reduced by a small margin, accordingly, the speed difference of a drum and feed push spiral blades is increased so that the liquid phase of the high-density solid phase is drained in advance, thus the stability of the cutting quality of the mortar is guaranteed, and no amount of money is lost.

Description

technical field [0001] The invention relates to the field of semiconductor free cutting mortar recovery, and specifically relates to a method for improving the centrifugal capacity of a centrifuge in a mortar recovery system. Background technique [0002] Silicon wafer multi-wire free cutting technology is a common silicon wafer cutting technology at present. Its basic principle is to use a high-speed moving steel wire to drive the mortar attached to the steel wire to rub the silicon rod, so as to achieve the cutting effect. The cutting mortar is mixed with polyethylene glycol and silicon carbide micropowder according to a certain ratio. [0003] During the use of cutting mortar, cutting silicon powder and broken silicon carbide micropowder will be mixed into the mortar at the same time; too much smaller micropowder (usually 1um and below) will affect the cutting ability of the mortar, resulting in abnormal surface condition of the product. The recycling system of cutting m...

AI Technical Summary

Problems solved by technology

During the use of the centrifuge, the pusher screw blade (such as figure 1 ) in the process of use, as time goes by, the radius of the pusher screw blade will be gradually worn; the secondary drum (such as figure 1 ) The solid deposited on the wall is getting thicker and thicker, which affects the quality of the mortar; and then affects the surface quality of silicon wafer cutting (such as abnormal line marks on the cutting surface)

[0006] The existing technology does not consider the influence of the wear of the pusher screw blade and the thicker and thicker solid deposited on the drum wall on the centrifugal force

It is common in the industry to reduce the cutting ability of mortar and implement one-time scrapping of the mortar in the entire system every 12 to 16 months; the loss amount is about 50,000 RMB

Images