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Mobile object device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and method for moving object

A technology of exposure device and moving body, applied in semiconductor/solid-state device manufacturing, photolithography process exposure device, photolithography process of pattern surface, etc., can solve the problem that the influence of air fluctuation cannot be ignored, etc.

Active Publication Date: 2018-06-08
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Here, when the position information of the substrate is obtained using an optical interferometer system, the influence of the so-called air fluctuation cannot be ignored.

Method used

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  • Mobile object device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and method for moving object
  • Mobile object device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and method for moving object
  • Mobile object device, exposure device, method for manufacturing flat panel display, method for manufacturing device, and method for moving object

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Experimental program
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no. 1 Embodiment approach 》

[0025] Below, use Figure 1 to Figure 10 (b) The first embodiment will be described.

[0026] figure 1 The structure of the liquid crystal exposure apparatus 10 of 1st Embodiment is shown schematically. The liquid crystal exposure apparatus 10 is a projection exposure apparatus of a step-and-scan method that uses a rectangular (corner) glass substrate P (hereinafter simply referred to as a substrate P) as an exposure object, for example, in a liquid crystal display device (flat panel display), that is, The so-called scanner.

[0027] The liquid crystal exposure apparatus 10 has an illumination system 12, a mask stage 14 holding a mask M formed with patterns such as circuit patterns, a projection optical system 16, an apparatus body 18, and is held on the surface ( figure 1 The substrate stage device 20 of the substrate P coated with a resist (sensing agent) on the surface facing the +Z side, their control system, and the like. Hereinafter, the direction in which the mask M...

no. 2 Embodiment approach 》

[0098] second use Figure 11 The second embodiment will be described. In the liquid crystal exposure apparatus of the second embodiment, the position information of the substrate P in the horizontal plane is obtained by using the encoder system as in the first embodiment, but the encoder system (in-horizontal plane position measuring system) The point that the head unit and the head unit for the Z inclination position measurement system are independent from each other is different from the above-mentioned first embodiment. Hereinafter, differences from the first embodiment will be described, and elements having the same configuration and function as those in the first embodiment will be assigned the same reference numerals as those in the first embodiment, and descriptions thereof will be omitted.

[0099] In the substrate position measuring system 70A of the second embodiment, the projection optical system 16 in the Y-axis direction (refer to figure 1 ) has one read head un...

no. 3 Embodiment approach 》

[0104] Second, use Figure 12 (a) and Figure 12 (b) The third embodiment will be described. In the configuration of the liquid crystal exposure apparatus of the third embodiment, the substrate P is used to face the projection optical system 16 (refer to figure 1 ) The configuration of the substrate stage device 120 for high-precision positioning is different from that of the first embodiment described above. The configuration of the measurement system for obtaining the position information of the substrate P in the six-degree-of-freedom directions is the same as that of the above-mentioned first embodiment. Hereinafter, only the points of difference from the above-mentioned first embodiment of the third embodiment will be described, and elements having the same configuration and function as those of the above-mentioned first embodiment will be given the same reference numerals as in the above-mentioned first embodiment and their description will be omitted.

[0105] In the...

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Abstract

A substrate stage device (20) for moving a substrate (P) is provided with: a non-contacting holder (32) for supporting the substrate (P) without contact; a first drive unit for moving the non-contacting holder (32); a scale plate (82) that acts as a reference for the movement of the non-contacting holder (32); a first measurement unit having a scale plate (46) and a Y head (78Y), either the scaleplate (46) or the Y head (78y) being provided to the non-contacting holder (32), and the other of the scale plate (46) and the Y head (78y) being provided between the scale plate (82) and the non-contacting holder (32), the first measurement unit measuring position information of the Y head (78y); a second measurement unit for measuring position information of the other of the scale plate (46) andthe Y head (78y); and a position measurement system for determining position information of the non-contacting holder (32) on the basis of the position information measured by the first and second measurement units.

Description

technical field [0001] The present invention relates to a mobile device, an exposure device, a method for manufacturing a flat-panel display, a method for manufacturing an element, and a method for moving an object. A device, a flat-panel display using an exposure device, or a method of manufacturing a device. Background technique [0002] In the past, in the lithography process of manufacturing electronic components (microcomponents) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), step-and-scan exposure devices (so-called scanning steppers (also called scanners) ), etc., which use energy beams while synchronously moving a photomask or reticle (hereinafter collectively referred to as "reticle") and a glass plate or wafer (hereinafter collectively referred to as "substrate") along a predetermined scanning direction The pattern formed on the photomask is transferred to the substrate. [0003] As this type of exposure apparatus,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20H01L21/68
CPCG03F7/707H01L21/68G03F7/70775G03F7/70758G03F7/7085G03F9/70G03F7/70725G03F7/70825G03F7/706845G03F7/70683G03F7/70791G03F9/7015G03F7/2002
Inventor 青木保夫
Owner NIKON CORP