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Detection device and detection method of solder paste dosage

A detection device and detection method technology, applied to general parts of printing machinery, printing, printing machines, etc., can solve problems that affect product quality, waste solder paste, increase the pressure of personnel inspection, etc.

Inactive Publication Date: 2018-06-19
NANTONG FUJITSU MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The amount of solder paste is not fixed. Generally, it is added according to the experience of the personnel or the whole tank. It is easy to cause too much or too little solder paste. In order to maintain the stability of the operation process, it is generally added in excess. The excess solder paste reaches the service life Abandoned after a certain period of time, resulting in waste of solder paste;
[0005] 2. The timing of adding needs to be observed by the operator. The operator’s self-consciousness and experience will affect the timing of adding. After a long period of observation, it is easy to increase the pressure of personnel inspection, resulting in errors and affecting product quality. waste of human resources

Method used

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  • Detection device and detection method of solder paste dosage
  • Detection device and detection method of solder paste dosage
  • Detection device and detection method of solder paste dosage

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Experimental program
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Effect test

Embodiment 1

[0042] This embodiment provides a detection device for the amount of solder paste, such as Figure 1-3 As shown, the detection device includes a clamping assembly 1, a quality sensor 2, a lifting assembly 3, a position sensor 4 and a control assembly (not shown), wherein:

[0043] Above-mentioned clamping assembly 1 is provided with two groups, and each group of clamping assembly 1 all comprises upper clamping block 11 and lower clamping block 12 that are positioned at the upper and lower sides of printed board 5, and upper clamping block 11 and lower clamping block 12 can Clamp and fix the printed board 5. Specifically, the above-mentioned lower clamping block 12 is located below the printing board 5 , and it is fixedly arranged on the printing equipment, and can be used for supporting the printing board 5 . The upper clamping block 11 is located above the printed board 5, and can move up and down relative to the lower clamping block 12. When the printed board 5 needs to be ...

Embodiment 2

[0070] The difference between the present embodiment and the first embodiment is only the position of the position sensor 4 and the way the position sensor 4 detects the preset distance. Others are the same as the first embodiment, and only the position of the position sensor 4 of the present embodiment will be described here. ,details as follows:

[0071] Can refer to Figure 5-7 The position sensor 4 of this embodiment is arranged on one side of the lifting platform 31 of the lifting assembly 3, and controls whether the lifting assembly 3 is running or not by detecting whether the moving distance of the lifting platform 31 reaches a preset distance. Specifically, when the lifting platform 31 is initially positioned at the non-lifting position, the position sensor 4 detects the position of the lifting platform 31 (referred to as the third detection position) and sends a third signal to the control assembly, when the driving member 32 of the lifting assembly 3 When driving th...

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PUM

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Abstract

The invention belongs to the technical field of printing, and discloses a detection device and a detection method of solder paste dosage. The detection device comprises a clamping assembly, mass sensors, a lifting assembly and a control assembly, wherein the clamping assembly is used for clamping a printing plate; the mass sensors are positioned below the printing plate; the mass sensors are mounted on the lifting assembly; the lifting assembly can drive the mass sensors to jack up the printing plate; and the control assembly is connected with the mass sensors and the lifting assembly. According to the detection device, the lifting assembly is controlled to drive the mass sensors to rise to jack up the printing plate by a preset distance, the mass of solder paste on the printing plate is detected through the mass sensors, when the mass of the solder paste is in a preset mass range, printing is normally carried out, when the mass of the solder paste exceeds the preset mass range, the control assembly sends out an alarm to remind an operator that the solder paste is excessive or insufficient, operation is stopped, and the purposes that the solder paste is saved and is prevented frombeing wasted, inspection pressure of personnel is reduced, and manpower resource cost and production cost are reduced are achieved.

Description

technical field [0001] The invention relates to the technical field of printing, in particular to a detection device and a detection method for the amount of solder paste. Background technique [0002] In the solder paste printing process, solder paste is used to fix components and substrates and perform permanent soldering during the reflow process. A certain amount of solder paste is required in the printing process to form a good roll printing. Usually, solder paste is added to the printing board through manual observation before the operation starts. During the operation, the operator observes the amount of solder paste and adds solder paste in time to maintain sufficient quality of solder paste on the printing board. on the printing plate, forming a stable print. [0003] The above method of presetting a large amount of solder paste and adding solder paste in a timely manner has the following problems in the actual operation process: [0004] 1. The amount of solder p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41F33/00
CPCB41F33/0036
Inventor 周锋卢海伦施陈束方沛
Owner NANTONG FUJITSU MICROELECTRONICS