Miniature embedded industrial control computer
An industrial control, embedded technology, applied in computing, instrumentation, electrical digital data processing, etc., can solve problems such as overheating, no heat dissipation function, and uneven heat dissipation
Pending Publication Date: 2018-06-26
EVOC SMART IOT TECH CO LTD
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Problems solved by technology
The functional I / O is generally distributed on the four surrounding surfaces, and the bottom surface is an ordinary flat surface, which has no direct heat dissipation function, resulting in uneven heat dissipation and local overheating
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[0031] In order to facilitate the understanding of the present invention, the micro-embedded industrial control computer will be described more fully below with reference to the relevant drawings. The preferred embodiment of the micro-embedded industrial control computer is given in the accompanying drawings. However, the miniature embedded industrial control computer can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosed content of the miniature embedded industrial control computer more thorough and comprehensive.
[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used in the description of the micro embedded industrial control computer herein are only for the purpose of describing specific embodime...
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The invention relates to a miniature embedded industrial control computer. The miniature embedded industrial control computer comprises first and second cooling plates, a side plate, a mainboard, a power supply board, a processor and a power supply conversion module; the first cooling plate comprises a first substrate and a first fin; the second cooling plate comprises a second substrate and a second fin; the side plate is connected with the first and second substrates; the side plate and the first and second substrates define an accommodation cavity; the first and second fins are both locatedoutside the accommodation cavity; the mainboard and the power supply board are both located in the accommodation cavity; the first side of the mainboard faces to the first substrate; the first side of the power supply board faces to the second substrate; the second side of the mainboard is opposite to that of the power supply board; the processor is located on the first side of the mainboard; andthe power supply conversion module is located on the first side of the power supply board. According to the miniature embedded industrial control computer, a cooling region is reasonably distributedin a finite space for optimizing the cooling efficiency, so that the problem of over-high local temperature of the miniature embedded industrial control computer is solved.
Description
technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a micro-embedded industrial control computer. Background technique [0002] The traditional miniature embedded industrial control computer often has the problem of local overheating. For example, the shape of the existing airtight and reinforced special computer is a hexahedron structure, and the upper and lower surfaces have a large area, of which the upper surface is used as a heat dissipation surface, designed as a heat sink with fins, and the internal processor, power supply conversion module and other heat-generating components They are all designed on a layer of circuit boards, and are in thermal contact with the heat sink, and the upper heat sink is responsible for heat dissipation. The functional I / O is generally distributed on the four surrounding surfaces, and the bottom surface is an ordinary flat surface, which has no direct heat dissipation function, re...
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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20
Inventor 史洪波王玉章张秋香
Owner EVOC SMART IOT TECH CO LTD