PCB design method based on bga solder joint reliability test
A design method and reliability technology, applied in the field of PCB design based on BGA solder joint reliability test, can solve problems such as solder joint life impact and solder joint failure, and achieve the effect of improving packaging quality and improving failure conditions
Active Publication Date: 2020-11-13
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
As the packaging density continues to increase, new materials such as lead-free solder balls, high-lead solder balls, and underfills, as well as CBGA (Ceramic Ball Grid Array) packages and PBGA (Plastic Ball Grid Array) packages , BGA underfill (Under Fill) and other new technology applications, BGA solder joints are also prone to failure, and the BGA size also has a certain impact on the life of solder joints
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[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.
[0028] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly disposed on the other element or may be disposed on the other element through an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or connected to the other element through intervening elements. Meanwhile, the singular forms of "a", "the" and "the" used herein are also intended to include plural forms unless the context clearly indicates oth...
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The invention discloses a PCB (Printed Circuit Board) design method based on a reliability test on BGA (Ball Grid Array) welding spots. The PCB design method comprises the following steps of welding aBGA module on a PCB, so as to obtain a to-be-tested device, wherein a welding spot array of the to-be-tested device comprises multiple welding spot rings with different distances to the center of thewelding spot array; putting the to-be-tested device into a testing box; selecting the welding spot rings needing to be tested, so as to obtain to-be-tested rings, and connecting at least two weldingspots of each to-be-tested ring with a resistance testing system by adopting connecting wires to form a to-be-tested access; starting the testing box, and beginning continuously measuring, by the resistance testing system, the resistance of the to-be-tested accesses corresponding to the different to-be-tested rings; obtaining the failure conditions of the welding spots corresponding to each to-be-tested ring according to the changes of the measured resistance, and then obtaining a design scheme of the PCB according to the failure conditions of the welding spots corresponding to each to-be-tested ring. The way of measuring, by the resistance testing system, the welding spots on the different welding spot rings is adopted by the PCB design method; the reliability of the BGA welding spots with the different distances to the center is accurately obtained, and the reference is provided for the BGA dimensional design in a specific use condition.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a PCB design method based on BGA solder joint reliability testing. Background technique [0002] BGA (Ball Grid Array) packaging, that is, ball grid array packaging, it is to make array solder balls on the bottom of the package substrate as the I / O terminal of the circuit and the printed circuit board (PCB). BGA packaging technology is used in integrated circuits and Electronic packaging has been widely used. As the packaging density continues to increase, new materials such as lead-free solder balls, high-lead solder balls, and underfills, as well as CBGA (Ceramic Ball Grid Array) packages and PBGA (Plastic Ball Grid Array) packages , BGA underfill (Under Fill) and other new technology applications, BGA solder joints are also prone to failure, and the BGA size also has a certain impact on the life of solder joints. Therefore, under the premise of constant materi...
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IPC IPC(8): G01N3/60G01M7/02G01N3/06
CPCG01M7/00G01N3/066G01N3/60G01N2203/0617
Inventor 李加全周波林茂
Owner GUANGZHOU FASTPRINT CIRCUIT TECH